Special Issue on Artificial Intelligence & Industrial Engineering

被引:1
|
作者
Chien, Chen-Fu [1 ]
Li, Minqiang [2 ]
机构
[1] Natl Tsing Hua Univ, Dept Ind Engn & Engn Management, Hsinchu, Taiwan
[2] Tianjin Univ, Dept Informat Management & Management Sci, Tianjin, Peoples R China
关键词
WAFER BIN MAP; MANUFACTURING INTELLIGENCE; OUTSOURCING DECISIONS; SEMICONDUCTOR; CLASSIFICATION; ALGORITHM; SYSTEM; YIELD;
D O I
10.1080/18756891.2014.947085
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
引用
收藏
页码:1 / 2
页数:2
相关论文
共 50 条
  • [21] Special Issue on Artificial Intelligence in Agriculture
    Dengel, Andreas
    [J]. KUNSTLICHE INTELLIGENZ, 2013, 27 (04): : 309 - 311
  • [23] Special issue on geospatial artificial intelligence
    Song Gao
    Yingjie Hu
    Wenwen Li
    Lei Zou
    [J]. GeoInformatica, 2023, 27 : 133 - 136
  • [25] Special Issue on: Artificial Intelligence in Education
    Xie, B.
    Wu, Y. H.
    [J]. INTERNATIONAL JOURNAL OF CONTINUING ENGINEERING EDUCATION AND LIFE-LONG LEARNING, 2019, 29 (1-2) : 1 - 4
  • [26] SPECIAL ISSUE ON ARTIFICIAL-INTELLIGENCE
    不详
    [J]. RECHERCHE, 1985, 16 (170): : 1125 - 1125
  • [27] Special Issue on Transdisciplinary Artificial Intelligence
    Persia, Fabio
    Glesener, Gary
    Greer, Julienne
    [J]. INTERNATIONAL JOURNAL OF SEMANTIC COMPUTING, 2023, 17 (04) : 493 - 494
  • [28] Special Issue on Human and Artificial Intelligence
    Sansonetti, Giuseppe
    D'Aniello, Giuseppe
    Micarelli, Alessandro
    [J]. APPLIED SCIENCES-BASEL, 2023, 13 (09):
  • [29] Special Issue on Artificial Intelligence at the Edge
    Falcao, Gabriel
    Cavallaro, Joseph
    [J]. IEEE MICRO, 2022, 42 (06) : 6 - 8
  • [30] Special issue on logics and artificial intelligence
    Falomir, Zoe
    Costa, Vicent
    Plaza, Enric
    Gibert, Karina
    [J]. LOGIC JOURNAL OF THE IGPL, 2021, 29 (01) : 1 - 6