3D Integration Technologies

被引：0
|
作者：
Ramm, Peter [1 ]
Klumpp, Armin [1 ]
Weber, Josef [1 ]
Taklo, Maaike M. V. [2 ]
机构：
[1] Fraunhofer Inst Reliabil & Microintegrat, Munich Div, Hansastr 27D, D-80606 Munich, Germany
[2] SINTEF, Dept Microsyst & Nanotechnol, Oslo, Norway
来源：
DTIP 2009: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS | 2009年
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D O I：
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中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
3D integration is a key solution to the predicted performance problems of future ICs as well as it offers extreme miniaturization and cost-effective fabrication of More than Moore products (e.g. e-CUBES (R)). Through Silicon Via (TSV) technologies enable high interconnect performance at relatively high fabrication cost compared to 3D packaging. A post backend-of-line TSV process is introduced as optimized technology for More than Moore products: The ICV-SLID process enables 3D integration of completely fabricated devices. Reliability issues, as thermo-mechanical stress caused by TSV formation and bonding are considered. The technology choice for the e-CUBES automotive application demonstrator is described.
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页码：71 / +
页数：2
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