3D DRAM Based Application Specific Hardware Accelerator for SpMV

被引：0
|
作者：
Sadi, Fazle [1 ]
Pileggi, Larry [1 ]
Franchetti, Franz [1 ]
机构：
[1] Carnegie Mellon Univ, Dept Elect & Comp Engn, Pittsburgh, PA 15213 USA
来源：
2016 IEEE HIGH PERFORMANCE EXTREME COMPUTING CONFERENCE (HPEC) | 2016年
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页数：1
相关论文
共 50 条
  • [21] Redundancy Architectures for Channel-Based 3D DRAM Yield Improvement
    Lin, Bing-Yang
    Chiang, Wan-Ting
    Wu, Cheng-Wen
    Lee, Mincent
    Lin, Hung-Chih
    Peng, Ching-Nen
    Wang, Min-Jer
    2014 IEEE INTERNATIONAL TEST CONFERENCE (ITC), 2014,
  • [22] TSV Technology and Challenges for 3D Stacked DRAM
    Lee, Chang Yeol
    Kim, Sungchul
    Jun, Hongshin
    Kim, Kyung Whan
    Hong, Sung Joo
    2014 SYMPOSIUM ON VLSI TECHNOLOGY (VLSI-TECHNOLOGY): DIGEST OF TECHNICAL PAPERS, 2014,
  • [23] Modeling and simulation of 3D structures for gigabit DRAM
    Kwon, O
    Yoon, S
    Ban, Y
    Won, T
    2000 INTERNATIONAL CONFERENCE ON MODELING AND SIMULATION OF MICROSYSTEMS, TECHNICAL PROCEEDINGS, 2000, : 688 - 691
  • [24] 3D hardware testing tips
    不详
    COMPUTER DESIGN, 1997, 36 (08): : 75 - 75
  • [25] APPLICATION OF ORTHODONTIC DIAGNOSIS BASED ON 3D SCANNING AND 3D PRINTING
    Yu, Z. L.
    Shao, Q.
    Liu, Q. P.
    Ren, L. Q.
    Ma, L.
    Zhang, Z. H.
    BASIC & CLINICAL PHARMACOLOGY & TOXICOLOGY, 2016, 118 : 56 - 56
  • [26] Analysis of Thermal Behavior for 3D Integration of DRAM
    Kim, Youngil
    Song, Yong Ho
    18TH IEEE INTERNATIONAL SYMPOSIUM ON CONSUMER ELECTRONICS (ISCE 2014), 2014,
  • [27] Enhanced Efficiency 3D Convolution Based on Optimal FPGA Accelerator
    Wang, Hai
    Shao, Mengjun
    Liu, Yan
    Zhao, Wei
    IEEE ACCESS, 2017, 5 : 6909 - 6916
  • [28] 3D DRAM时代即将到来，泛林集团这样构想3D DRAM的未来架构
    Benjamin Vincent
    世界电子元器件, 2023, (08) : 13 - 18
  • [29] π-BA: Bundle Adjustment Hardware Accelerator Based on Distribution of 3D-Point Observations
    Liu, Qiang
    Qin, Shuzhen
    Yu, Bo
    Tang, Jie
    Liu, Shaoshan
    IEEE TRANSACTIONS ON COMPUTERS, 2020, 69 (07) : 1083 - 1095
  • [30] A Cloud 3D Dataset and Application-Specific Learned Image Compression in Cloud 3D
    Liu, Tianyi
    He, Sen
    Jayakumar, Vinodh Kumaran
    Wang, Wei
    COMPUTER VISION, ECCV 2022, PT XXXVIII, 2022, 13698 : 268 - 284
12345