Design for reliability of multi-layer stretchable interconnects

被引:14
|
作者
Hsu, Yung-Yu [1 ]
Papakyrikos, Cole [1 ]
Liu, Daniel [1 ]
Wang, Xianyan [1 ]
Raj, Milan [1 ]
Zhang, Baosheng [1 ]
Ghaffari, Roozbeh [1 ]
机构
[1] MC10 Inc, Cambridge, MA 02140 USA
关键词
stretchable electronics; interconnect; reliability; failure analysis;
D O I
10.1088/0960-1317/24/9/095014
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this investigation, the electrical performance and reliability of multi-layer stretchable metal interconnects are evaluated using numerical simulations and experimental analysis. The numerical results show that the bi-layer design of stretchable interconnects have similar mechanics when compared to single layer interconnect structures. In contrast, interconnects configured in an in-plane stacked arrangement exhibit increased equivalent plastic strain during elongation, and consequently support less stretching. Our experimental results support these numerical findings. Maximum stretchability approaches similar to 150% elongation for single layer and bi-layer interconnects. In addition, fatigue experiments at 60% elongation show that the bi-layer design of stretchable interconnects have life cycles three orders of magnitude higher than the in-plane stacked arrangement of stretchable interconnects.
引用
收藏
页数:7
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