共 50 条
- [1] Design for Reliability of Multi-Layer Thin Film Stretchable Interconnects [J]. 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 623 - 628
- [4] Reliability analysis for the design of a multi-layer flexible board [J]. 55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 1299 - 1304
- [5] On the Resistivity of Multi-Layer Graphene Nanoribbon Interconnects [J]. 2019 27TH IRANIAN CONFERENCE ON ELECTRICAL ENGINEERING (ICEE 2019), 2019, : 50 - 53
- [10] Investigation of mechanical reliability of Cu/low-k multi-layer interconnects in flip chip packages [J]. EUROSIME 2007: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, PROCEEDINGS, 2007, : 673 - +