Thermal stability of nanocrystalline copper films

被引：3
|
作者：
Cao, Peng [1 ]
Zhang, Deliang [1 ]
机构：
[1] Univ Waikato, Dept Mat & Proc Engn, Hamilton, New Zealand
来源：
INTERNATIONAL JOURNAL OF MODERN PHYSICS B | 2006年 / 20卷 / 25-27期
关键词：
nanocrystalline; thin film; copper; thermal stability;
D O I：
10.1142/S0217979206040441
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
The grain growth kinetics of nanocrystalline copper thin film samples was investigated. The grain size of nanocrystalline copper samples was determined from the broadening of X-ray spectra. It was found that the grain size increased linearly with isothermal annealing time within the first 10 minutes, beyond which power-law growth kinetics is applied. The activation energy for grain growth was determined by constructing an Arrhenius plot, which shows an activation energy of about 21 - 30 kJ/mol. The low activation energy is attributed to the second phase particle drag and the porosity drag, which act as the pinning force for grain growth in nanocrystalline copper.
引用
收藏
页码：3830 / 3835
页数：6
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