Multisite test strategy for SIP mobile technologies

被引：0
|
作者：
McEleney, Jim [1 ]
Kramer, Randy [1 ]
机构：
[1] Teradyne, Semicond Test Div, Boston, MA 02118 USA
来源：
EE-EVALUATION ENGINEERING | 2006年 / 45卷 / 07期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The challenge of SIPs goes beyond what it takes to assemble them.
引用
收藏
页码：12 / +
页数：6
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