Multisite test strategy for SIP mobile technologies

被引:0
|
作者
McEleney, Jim [1 ]
Kramer, Randy [1 ]
机构
[1] Teradyne, Semicond Test Div, Boston, MA 02118 USA
来源
EE-EVALUATION ENGINEERING | 2006年 / 45卷 / 07期
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The challenge of SIPs goes beyond what it takes to assemble them.
引用
收藏
页码:12 / +
页数:6
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