Microfabrication and experimental characterization of an Out-of-Plane MEMS switch

被引:0
|
作者
Baracu, Angela [1 ]
Muller, Raluca [1 ]
Voicu, Rodica [1 ]
Tibeica, Catalin [1 ]
Dinescu, Adrian [1 ]
Pustan, Marius [2 ]
Birleanu, Corina [2 ]
机构
[1] Natl Inst Res & Dev Microtechnol IMT Bucharest, Bucharest, Romania
[2] Tech Univ Cluj Napoca, Micro & Nano Syst Lab, Cluj Napoca, Romania
关键词
MEMS switch; thermal actuator; microfabrication; sacrificial layer;
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
This paper presents an approach to improve the performance of a Micro-Electro-Mechanical (MEMS) switch with vertical movement, manufactured using surface micromachining technology. We focused on the investigations of the critical technological dimensions (gap, thickness of the arms) in order to obtain a released, stable mechanical structure and to avoid the stiction effect of the metallic shapes. Technological experiments, Scanning Electron Microscopy (SEM) investigations, CoventorWare and Comsol simulations were performed in order to investigate the electro-thermo-mechanical behaviour of the switch.
引用
收藏
页码:124 / 134
页数:11
相关论文
共 50 条
  • [1] Monolithic MEMS optical switch with amplified out-of-plane angular motion
    López, D
    Simon, ME
    Pardo, F
    Aksyuk, V
    Klemens, F
    Cirelli, R
    Neilson, DT
    Shea, H
    Sorsch, T
    Ferry, E
    Nalamasu, O
    Gammel, PL
    2002 IEEE/LEOS INTERNATIONAL CONFERENCE ON OPTICAL MEMS, CONFERENCE DIGEST, 2002, : 165 - 166
  • [2] Interconnect for out-of-plane MEMS assembly
    Aarts, A. A. A.
    Neves, H. P.
    Puers, R. P.
    Van Hoof, C.
    PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2008, : 132 - +
  • [3] A novel out-of-plane MEMS tunneling accelerometer
    Dong, HF
    Jia, YB
    Hao, YL
    Shen, SM
    SENSORS AND ACTUATORS A-PHYSICAL, 2005, 120 (02) : 360 - 364
  • [4] EXPERIMENTAL STUDY OF OUT-OF-PLANE ADHESION FORCE EVOLUTION (AND REGRESSION) FOR MEMS ACCELEROMETERS
    Dellea, Stefano
    Rizzini, Francesco
    Tocchio, Alessandro
    Ardito, Raffaele
    Langelder, Giacomo
    2016 IEEE 29TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 2016, : 1006 - 1009
  • [5] MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength
    do Valle, Tiago Vicentini Ferreira
    Mariani, Stefano
    Ghisi, Aldo
    De Masi, Biagio
    Rizzini, Francesco
    Gattere, Gabriele
    Valzasina, Carlo
    MICROMACHINES, 2023, 14 (02)
  • [6] Integrated Thermally Actuated MEMS Switch with the Signal Line for the Out-of-Plane Actuation<bold> </bold>
    Pustan, Marius
    Birleanu, Corina
    Dudescu, Cristian
    Muller, Raluca
    Baracu, Angela
    2018 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP), 2018,
  • [7] Experimental characterization of the in-plane and out-of-plane behaviour of infill masonry walls
    Furtado, Andre
    Rodrigues, Hugo
    Arede, Antonio
    Varum, Humberto
    ICSI 2015 THE 1ST INTERNATIONAL CONFERENCE ON STRUCTURAL INTEGRITY FUNCHAL, 2015, 114 : 862 - 869
  • [8] Aluminum Nitride Out-of-Plane Piezoelectric MEMS Actuators
    Rabih, Almur A. S.
    Kazemi, Mohammad
    Menard, Michael
    Nabki, Frederic
    MICROMACHINES, 2023, 14 (03)
  • [9] OUT-OF-PLANE DIRECTION THERMAL ACTUATER FOR OPTICAL MEMS
    Kiuchi, Mario
    Okimoto, Naoki
    Hirata, Yasuyuki
    Matsuoka, Gen
    Torayashiki, Osamu
    2019 20TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS & EUROSENSORS XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019, : 1556 - 1559
  • [10] An out-of-plane MEMS quadrupole for a portable mass spectrometer
    Velasquez-Garcia, L. F.
    Akinwande, A. I.
    TRANSDUCERS '07 & EUROSENSORS XXI, DIGEST OF TECHNICAL PAPERS, VOLS 1 AND 2, 2007,