A novel compact ECD tool for ULSI Cu metallization

被引：2
|
作者：
Tsujimura, M [1 ]
Mishima, K [1 ]
Kunisawa, J [1 ]
Makino, N [1 ]
机构：
[1] Ebara Corp, Ohta Ku, Tokyo 1448721, Japan
来源：
ISSM 2000: NINTH INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, PROCEEDINGS | 2000年
关键词：
ECD; Cu metallization; porous ceramic;
D O I：
10.1109/ISSM.2000.993627
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A novel compact ECD (Electro chemical Deposition) tool was designed and developed for Cu multi-level interconnection. The design enables the entire plating process (i.e., pre-processing, electro-chemical deposition, cleaning, and drying processed wafers) to be performed using a single module, by which means optimum Raw Process Time, good uptime and low COO can be achieved. The merit of the unique design using a porous ceramic presented here are non-uniformity improvement, edge profile control, and black-film protection.
引用
收藏
页码：106 / 109
页数：4
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