Modeling the Tunnel Field-Effect Transistor Based on Different Tunneling Path Approaches

被引:5
|
作者
Wisniewski, Piotr [1 ,2 ]
Majkusiak, Bogdan [1 ]
机构
[1] Warsaw Univ Technol, Inst Microelect & Optoelect, PL-00662 Warsaw, Poland
[2] Warsaw Univ Technol, Ctr Adv Mat & Technol, PL-02822 Warsaw, Poland
关键词
Interband tunneling; semiconductor devices; tunnel transistors; INTERFACE-TRAP CHARGES; FET; PERFORMANCE; DESIGN; TFET;
D O I
10.1109/TED.2018.2821059
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, the effect of a choice of the tunneling path approach on electrical characteristics of the silicon tunnel field-effect transistor (TFET) is theoretically investigated with the use of a developed 2-D semiclassical numerical simulator and a nonlocal band-to-band tunneling generation model. Three different tunneling path approaches are defined and examined: horizontal path, maximum valence band gradient, and minimum tunneling distance. Double-gate (DG) and single-gate (SG) transistor structures are considered, and effects of the silicon body thickness and the gate-source overlap are investigated. The differently defined tunneling paths lead to significantly different on currents. It is shown that theminimumtunneling distance approach results in the highest tunnel current, whereas the horizontal path approach underestimates the current, especially for thick semiconductor body layers and the SG transistor structures. A choice of the tunneling path approach can be crucial for the accuracy of modeling the drain current of the TFETs.
引用
收藏
页码:2626 / 2631
页数:6
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