Simulation of electroless plating of nickel with sodium hypophosphite

被引：0
|
作者：
Sotskaya, NV
Aristov, IV
Goncharova, LG
Kravchenko, TA
机构：
来源：
RUSSIAN JOURNAL OF APPLIED CHEMISTRY | 1997年 / 70卷 / 03期
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D O I：
暂无
中图分类号：
O69 [应用化学];
学科分类号：
081704 ;
摘要：
The quantitative relationship between the rate of electroless plating and the solution composition was studied for the first time using a combined regression equation. A model is proposed accounting for the contribution of each component of a multicomponent system and their interaction and describing quantitatively the course of the reaction.
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页码：407 / 409
页数：3
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