Exploring the 3D integration technology for CMOS image sensors

被引：0
|
作者：
Raymundo, Fernando [1 ]
Martin-Gonthier, Phillipe [1 ]
Molina, Romain [1 ]
Rolando, Sebastien [1 ]
Magnan, Pierre [1 ]
机构：
[1] Univ Toulouse, CIMI Image Sensor Lab, ISAE, F-31055 Toulouse, France
来源：
2013 IEEE 11TH INTERNATIONAL WORKSHOP OF ELECTRONICS, CONTROL, MEASUREMENT, SIGNALS AND THEIR APPLICATION TO MECHATRONICS (ECMSM) | 2013年
关键词：
CMOS Image Sensor; Three dimensional integration technology; ADC; parallelism;
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
3D fabrication technologies allow microelectronic circuits such as processors or memories to achieve very high integration densities. These technologies applied to CMOS image sensors, make possible the implementation of specific processing architectures without damaging key parameters of CMOS imagers. This paper illustrates these benefits with an implementation of a 3D image sensor integrating at the pixel level a low noise circuit coupled to an analog to digital converter.
引用
收藏
页数：5
相关论文
共 50 条
  • [41] DESIGN AND DEVELOPMENT OF 3D WLCSP FOR CMOS IMAGE SENSOR USING VERTICAL VIA TECHNOLOGY
    Zhou, Tianshen
    Ma, Shuying
    Zheng, Fengxia
    Hang, Tao
    2020 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2020 (CSTIC 2020), 2020,
  • [42] Multi-storied photodiode CMOS image sensor for multiband imaging with 3D technology
    Takemoto, Y.
    Kobayashi, K.
    Tsukimura, M.
    Takazawa, N.
    Kato, H.
    Suzuki, S.
    Aoki, J.
    Kondo, T.
    Saito, H.
    Gomi, Y.
    Matsuda, S.
    Tadaki, Y.
    2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2015,
  • [43] 3-D optical and electrical simulation for CMOS image sensors
    Mutoh, H
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (01) : 19 - 25
  • [44] Exploring potential benefits of 3D FPGA integration
    Ababei, C
    Maidee, P
    Bazargan, K
    FIELD-PROGRAMMABLE LOGIC AND APPLICATIONS, PROCEEDINGS, 2004, 3203 : 874 - 880
  • [45] Advances, Challenges and Opportunities in 3D CMOS Sequential Integration
    Batude, P.
    Vinet, M.
    Previtali, B.
    Tabone, C.
    Xu, C.
    Mazurier, J.
    Weber, O.
    Andrieu, F.
    Tosti, L.
    Brevard, L.
    Sklenard, B.
    Coudrain, P.
    Bobba, S.
    Ben Jamaa, H.
    Gaillardon, P-E.
    Pouydebasque, A.
    Thomas, O.
    Le Royer, C.
    Hartmann, J. -M.
    Sanchez, L.
    Baud, L.
    Carron, V.
    Clavelier, L.
    De Micheli, G.
    Deleonibus, S.
    Faynot, O.
    Poiroux, T.
    2011 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2011,
  • [46] Smart Image Sensors and Their Application to 3D Imaging
    Hamamoto, Takayuki
    Yamagishi, Hironori
    Hosaka, Tadaaki
    IDW'11: PROCEEDINGS OF THE 18TH INTERNATIONAL DISPLAY WORKSHOPS, VOLS 1-3, 2011, : 1319 - 1322
  • [47] Embedded Sensors with 3D Printing Technology: Review
    Bas, Joan
    Dutta, Taposhree
    Garro, Ignacio Llamas
    Velazquez-Gonzalez, Jesus Salvador
    Dubey, Rakesh
    Mishra, Satyendra K.
    SENSORS, 2024, 24 (06)
  • [48] Ion Image Sensors Based On CCD/CMOS Technology
    Sawada, Kazuaki
    2012 IEEE SENSORS PROCEEDINGS, 2012, : 135 - 137
  • [49] Integration of Ultrasonic Sensors and Kinect Sensors for People Distinction and 3D Localization
    Adachi, Takayuki
    Goseki, Masafumi
    Takemura, Hiroshi
    Mizoguchi, Hiroshi
    Kusunoki, Fusako
    Sugimoto, Masanori
    Yamaguchi, Etsuji
    Inagaki, Shigenori
    Takeda, Yoshiaki
    JOURNAL OF ROBOTICS AND MECHATRONICS, 2013, 25 (04) : 762 - 766
  • [50] Integration of CMOS Image Sensor and Microwell Array Using 3-D WLCSP Technology for Biodetector Application
    Zhao, Shuai
    Yu, Daquan
    Zou, Yichao
    Yang, Chaodong
    Yang, Xiaobing
    Xiao, Zhiyi
    Chen, Pei
    Qin, Fei
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (04): : 624 - 632
12345