DESIGN AND IMPLEMENTATION OF HIGH FILL-FACTOR STRUCTURES FOR LOW-COST CMOS MICROBOLOMETERS

被引：0

作者：

Erturk, Ozan ^{[1
,2
]}

Akin, Tayfu ^{[1
,2
]}

机构：

[1] Middle East Tech Univ, Elect & Elect Engn, Ankara, Turkey

[2] METU MEMS Res & Applicat Ctr, Ankara, Turkey

来源：

2018 IEEE MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) | 2018年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports utilization of high-fill factor absorber structures integrated onto SOI diode type low-cost uncooled microbolometers for broadband absorption performance. Mechanical and optical simulations are performed to assess the enhancement and mechanical stability of the absorber structures. Reported first time in the literature, four types of different absorber structures are employed on the same detector focal plane array (FPA) in order to evaluate the improvement provided by different absorber structures comparatively on the same sensor. This study is conducted on 50 mu m pitched pixels with the FPA format of 160 x 120.

引用

页码：692 / 695

页数：4

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