Impacts of Fluorine-treatment on E-mode AlGaN/GaN MOS-HEMTs

被引:0
|
作者
Sun, X. [1 ]
Zhang, Y. [2 ]
Chang-Liao, K. S. [3 ]
Palacios, T. [2 ]
Ma, T. P. [1 ]
机构
[1] Yale Univ, New Haven, CT 06520 USA
[2] MIT, Cambridge, MA 02139 USA
[3] Natl Tsing Hua Univ, Hsinchu 30013, Taiwan
来源
2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2014年
关键词
THRESHOLD-VOLTAGE;
D O I
暂无
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
The impact of fluorine treatment on AlGaN/GaN MOS-HEMTs has been investigated. Fluorine was found to suppress pre-existing traps in MOS-HEMT, which improves the off-state at high temperatures. Fluorine doping and associated etching, however, also generates slow border traps and fast interface states that degrade the MOS-HEMT performance. Multi-faceted mechanisms for drain current degradation due to F-doping and gate-recess-etch have been investigated in enhancement-mode MOS-HEMTs.
引用
收藏
页数:4
相关论文
共 50 条
  • [41] Device Characteristics of AlGaN/GaN MOS-HEMTs Using High-k Praseodymium Oxide Layer
    Chiu, Hsien-Chin
    Yang, Chih-Wei
    Lin, Yung-Hsiang
    Lin, Ray-Ming
    Chang, Liann-Be
    Horng, Kuo-Yang
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2008, 55 (11) : 3305 - 3309
  • [42] Monolithic Integration of D/E-mode Tri-gate AlGaN/GaN MIS-HEMTs for Power ICs
    Li, Ang
    Wang, Weisheng
    Li, Fan
    Zhu, Yuhao
    Zhang, Yuanlei
    Liu, Wen
    Yu, GuoHao
    Zeng, Zhongming
    Zhang, Baoshun
    2024 36TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND IC S, ISPSD 2024, 2024, : 371 - 373
  • [43] High-performance enhancement-mode AlGaN/GaN MOS-HEMTs with fluorinated stack gate dielectrics and thin barrier layer
    高涛
    徐锐敏
    张凯
    孔月婵
    周建军
    孔岑
    郁鑫鑫
    董迅
    陈堂胜
    Journal of Semiconductors, 2016, (06) : 116 - 119
  • [44] High-performance enhancement-mode AlGaN/GaN MOS-HEMTs with fluorinated stack gate dielectrics and thin barrier layer
    Gao Tao
    Xu Ruimin
    Zhang Kai
    Kong Yuechan
    Zhou Jianjun
    Kong Cen
    Yu Xinxin
    Dong Xun
    Chen Tangsheng
    JOURNAL OF SEMICONDUCTORS, 2016, 37 (06)
  • [45] High-performance enhancement-mode AlGaN/GaN MOS-HEMTs with fluorinated stack gate dielectrics and thin barrier layer
    高涛
    徐锐敏
    张凯
    孔月婵
    周建军
    孔岑
    郁鑫鑫
    董迅
    陈堂胜
    Journal of Semiconductors, 2016, 37 (06) : 116 - 119
  • [46] The Effect of Fluorine Doping in the Charge Trapping Layer on Device Characteristics and Reliability of E-Mode GaN MIS-HEMTs
    Yang, Tsung-Ying
    Wu, Sih-Rong
    Wu, Jui-Sheng
    Liang, Yan-Kui
    Kuo, Mei-Yan
    Iwai, Hiroshi
    Chang, Edward-Yi
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024, 71 (06) : 3603 - 3608
  • [47] Oxide thickness dependent compact model of channel noise for E-mode AlGaN/GaN MOS-HEMT
    Panda, D. K.
    Lenka, T. R.
    AEU-INTERNATIONAL JOURNAL OF ELECTRONICS AND COMMUNICATIONS, 2017, 82 : 467 - 473
  • [48] DC characteristics with substrate temperature for GaN on Si MOS-HEMTs
    Rodriguez, R.
    Gonzalez, B.
    Garcia, J.
    Vega, A.
    Nunez, A.
    2017 SPANISH CONFERENCE ON ELECTRON DEVICES (CDE), 2017,
  • [49] Small Signal and Pulse Characteristics of AlN/GaN MOS-HEMTs
    MacFarlane, D.
    Taking, S.
    Murad, S. K.
    Wasige, E.
    2011 6TH EUROPEAN MICROWAVE INTEGRATED CIRCUIT CONFERENCE, 2011, : 340 - 343
  • [50] Performance improvement in NiO x -based GaN MOS-HEMTs
    Meer, M.
    Pohekar, P.
    Parvez, B.
    Ganguly, S.
    Saha, D.
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2022, 37 (08)