Pb-free surface-finishing on electronic components' terminals for Pb-free soldering assembly

被引：12
|
作者：
Tanaka, H [1 ]
Tanimoto, M [1 ]
Matsuda, A [1 ]
Uno, T [1 ]
Kurihara, M [1 ]
Shiga, S [1 ]
机构：
[1] Furukawa Elect Corp Ltd, Div R&D, Met Res Ctr, Nikko 3210942, Japan
来源：
JOURNAL OF ELECTRONIC MATERIALS | 1999年 / 28卷 / 11期
关键词：
Pb-free surface-finishing; Sn-Bi with Sn undercoat; Pd with Ni undercoat;
D O I：
10.1007/s11664-999-0160-5
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Pb-free solderable surface finishing is essential to implement Pb-free solder assembly in order to meet with the growing demand of environmental consciousness to eliminate Pb from electronic products. Two types of widely applicable Pb-free surface finishing technologies are developed. One is the multilayer-system including Pd with Ni undercoat. Heat-resistance of Pd enables whole-surface-plating on to leadframe before IC-assembling process. The other is the double-layer-system with low-melting-point-materials, for example, thicker Sn underlayer and thinner Sn-Bi alloy overlayer, dilutes Sn-Bi alloy's defects of harmful reactivity along with substrate metal and mechanical brittleness with keeping its advantages of solder-wettability and no whisker.
引用
收藏
页码：1216 / 1223
页数：8
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