共 50 条
- [42] Theory of tin whisker growth: "The end game" IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (01): : 11 - 22
- [44] Tin Whisker Growth on Electroplating Sn Bilayer 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 931 - +
- [45] Study of Factors Influencing Tin Whisker Growth 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 939 - 943
- [46] Length distribution analysis for tin whisker growth IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (01): : 36 - 40
- [47] Mitigation of Tin Whisker Growth by Dopant Addition INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2, 2015,
- [48] Electron microscopy study of tin whisker growth Journal of Materials Research, 2003, 18 : 585 - 593
- [50] Growth behavior and mechanism of tin whisker on isolated SnAg solder under compressive stress 2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM), 2021,