Automation is key to getting lean for 450mm manufacturing

被引：0

作者：

Lee, Brandon ^{[1
]}

Talbert, Dennis ^{[1
]}

机构：

[1] CIMAC Inc, San Jose, CA 95126 USA

来源：

SOLID STATE TECHNOLOGY | 2009年 / 52卷 / 04期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

ISMI has been the leader in implementing small-lot manufacturing and single wafer processing for 300mm Prime and next-generation factory (NGF) 450mm manufacturing. By driving and gathering the implementation requirements from chip makers and equipment suppliers, ISMI makes it simpler for chip makers to select NGF MES supplier products and plan for their fab MES deployment. For the advanced 300mm Prime and the NGF 450mm, the main goal is to enhance the productivity improvements necessary to implement fully continuous processing. To achieve this goal, wafer processing interruptions and improving waste reduction in the fab are the keys to success.

引用

页码：18 / 21

页数：4

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