Heat transfer and friction factor performance in a pin fin wedge duct with different dimple arrangements

被引:32
|
作者
Luo, Lei [1 ,2 ]
Wang, Chenglong [2 ]
Wang, Lei [2 ]
Sunden, Bengt [2 ]
Wang, Songtao [1 ]
机构
[1] Harbin Inst Technol, Sch Energy Sci & Engn, Harbin 150006, Peoples R China
[2] Lund Univ, Dept Energy Sci, Div Heat Transfer, SE-22100 Lund, Sweden
关键词
FLOW STRUCTURE; PRESSURE-DROP; CHANNEL; NUMBER;
D O I
10.1080/10407782.2015.1052301
中图分类号
O414.1 [热力学];
学科分类号
摘要
In this study, numerical simulations are conducted to investigate the effects of dimple positions on the endwall heat transfer and friction factor in a pin fin wedge duct. The dimple diameter is the same as the pin fin diameter, while the ratio between dimple depth and dimple diameter is 0.2. Three different dimple positions are investigated (i.e., directly upstream of the pin fins, in a staggered manner relative to the pin fins, or in line with the pin fins. The Reynolds number ranges from 10,000 to 50,000. Results for endwall Nusselt number, friction factor, and flow structure are included. For convenience of comparison, the pin fin wedge duct without dimples is studied as baseline. It is found that dimples can effectively enhance endwall heat transfer. Among the tested parameters, the dimple position in line with the pin fins provides the best heat transfer enhancement, with low friction factor penalty. However, the various dimple positions have distinct effects on the friction factor depending on the flow structure near the dimple zone. For the first position, the friction factor is markedly increased due to flow impingement, recirculation, and mixing, while for the second and third positions, the friction factor is changed slightly due to different flow behaviors.
引用
收藏
页码:209 / 226
页数:18
相关论文
共 50 条
  • [41] Flow structure and heat transfer characteristics of a 90°-turned pin-finned wedge duct with dimples at different locations
    Luo, Lei
    Du, Wei
    Wang, Songtao
    Sunden, Bengt
    Zhang, Xinghong
    NUMERICAL HEAT TRANSFER PART A-APPLICATIONS, 2018, 73 (03) : 143 - 162
  • [42] Effect of short pin fin with different shapes and arrangements on thermal resistance of micro heat sink
    Kewalramani G.V.
    Hedau G.
    Saha S.K.
    Agrawal A.
    Journal of Enhanced Heat Transfer, 2020, 27 (06): : 491 - 503
  • [43] EFFECT OF SHORT PIN FIN WITH DIFFERENT SHAPES AND ARRANGEMENTS ON THERMAL RESISTANCE OF MICRO HEAT SINK
    Kewalramani, Gagan, V
    Hedau, Gaurav
    Saha, Sandip K.
    Agrawal, Amit
    JOURNAL OF ENHANCED HEAT TRANSFER, 2020, 27 (06) : 491 - 503
  • [44] Investigation of a natural convection heat transfer enhancement of a different shaped pin fin heat sink for different vertical fin spacing
    Ram Deshmukh
    V. N. Raibhole
    Heat and Mass Transfer, 2023, 59 : 2131 - 2148
  • [45] TURBULENT HEAT-TRANSFER AND FRICTION IN PIN FIN CHANNELS WITH LATERAL FLOW EJECTION
    LAU, SC
    HAN, JC
    KIM, YS
    JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1989, 111 (01): : 51 - 58
  • [46] HEAT TRANSFER AND FLOW-FRICTION CHARACTERISTICS OF 9 PIN-FIN SURFACES
    THEOCLIT.G
    MECHANICAL ENGINEERING, 1965, 87 (10) : 78 - &
  • [47] Investigation of a natural convection heat transfer enhancement of a different shaped pin fin heat sink for different vertical fin spacing
    Deshmukh, Ram
    Raibhole, V. N.
    HEAT AND MASS TRANSFER, 2023, 59 (11) : 2131 - 2148
  • [48] EFFECT OF DIMPLE ARRANGEMENTS ON THE TURBULENT HEAT TRANSFER IN A DIMPLED CHANNEL
    Lee, Y. O.
    Ahn, J.
    Kim, J.
    Lee, J. S.
    JOURNAL OF ENHANCED HEAT TRANSFER, 2012, 19 (04) : 359 - 367
  • [49] Effect of pin fin to channel height ratio and pin fin geometry on heat transfer performance for flow in rectangular channels
    Pandit, Jaideep
    Thompson, Megan
    Ekkad, Srinath V.
    Huxtable, Scott T.
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2014, 77 : 359 - 368
  • [50] Effects of pin fin arrangement its heat transfer characteristics on performance of heat sink
    Mate, Dnyaneshwar M.
    Tale, Vithoba T.
    MATERIALS TODAY-PROCEEDINGS, 2021, 43 : 2377 - 2382