Defect-Free Dicing for Higher Device Reliability

被引：0
|
作者：
Johnston, Christopher [1 ]
Piallat, Fabien [2 ]
机构：
[1] Adv Vacuum, Lomma, Sweden
[2] Plasma Therm, Bernin, France
来源：
2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC) | 2018年
关键词：
dicing; plasma dicing; singulation; stress relief; die strength; advanced packaging; dicing quality; die chipping; silicon damage; blade dicing; laser dicing; stealth dicing; delamination; street width; die spacing; round corners; round edges; die shapes; non-orthogonal; etch profile; BOSCH process; DRIE; RIE dicing tape; UV tape; high selectivity; crack stop; mechanical stress; thermal stress; sidewall roughness; profile control; die profile; low temperature etching; gentle etching; exposed metals; exposed bumps; exposed pads; round die; hexagon die; test keys; TEG; PCM;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：4
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