Conductive microcapsules for self-healing electric circuits

被引：13

作者：

Lai, G. W. ^{[1
]}

Chang, S. J. ^{[2
]}

Lee, J. T. ^{[3
,4
]}

Liu, H. ^{[1
]}

Li, C. C. ^{[1
]}

机构：

[1] Natl Taipei Univ Technol, Inst Mat Sci & Engn, Dept Mat & Mineral Resources Engn, Taipei 10608, Taiwan

[2] Ind Technol Res Inst, Mat & Chem Res Labs, Hsinchu 30011, Taiwan

[3] Natl Sun Yat Sen Univ, Dept Chem, Kaohsiung 80424, Taiwan

[4] Kaohsiung Med Univ, Dept Med & Appl Chem, Kaohsiung 80708, Taiwan

来源：

RSC ADVANCES | 2015年 / 5卷 / 126期

关键词：

ANTICORROSION COATINGS; MICROENCAPSULATION; NANOPARTICLES; EPOXY;

D O I：

10.1039/c5ra22021a

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

Conductive microcapsules that are compatible with inorganic-based materials such as Ag conductive paste for casting electric circuits are prepared. These conductive microcapsules show high efficiency, more than 80% within 30 s, for the restoration of an interrupted circuit that presented a cracking width of about 150 mu m.

引用

页码：104145 / 104148

页数：4

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