Advanced structural process monitoring, using in-line FIB

被引：0

作者：

Bloess, H ^{[1
]}

Zelenko, J ^{[1
]}

Klinger, J ^{[1
]}

Mata, C ^{[1
]}

Levin, J ^{[1
]}

Ventola, S ^{[1
]}

Kelsari, S ^{[1
]}

机构：

[1] Infineon Technol, Dresden, Germany

来源：

2004 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP: ADVANCING THE SCIENCE AND TECHNOLOGY OF SEMICONDUCTOR MANUFACTURING EXCELLENCE | 2004年

关键词：

D O I：

10.1109/ASMC.2004.1309552

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper the challenges of incorporating in-line FIB as process monitor will be discussed, for both process qualification phase as well as production phase. Results of advanced FIB capabilities using Applied's SEMVision G2FIB will be demonstrated on some of Infineon's most challenging process steps, previously lacking in-line capability. In addition, the efforts and results of developing best known methods (BKMs) for FIB milling, deposition techniques (capping) and imaging will be discussed and shown comparing results to traditional lab profile measurement techniques.

引用

页码：140 / 143

页数：4

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