A Comparison of Metal Adhesion Layers for Au Films in Thermo-Plasmonic Applications

被引：0
|
作者：
Abbott, William M. [1 ,2 ]
Murray, Christopher P. [1 ,2 ]
Lochlainn, Sorcha Ni [1 ,2 ]
Bello, Frank [1 ,2 ]
Zhong, Chuan [1 ,2 ]
Smith, Christopher [1 ,2 ]
Petford-Long, Amanda K. [3 ,4 ]
Donegan, John F. [1 ,2 ]
McCloskey, David [1 ,2 ]
机构：
[1] Trinity Coll Dublin, Sch Phys, CRANN, Dublin 2, Ireland
[2] Trinity Coll Dublin, AMBER, Dublin 2, Ireland
[3] Argonne Natl Lab, Div Mat Sci, 9700 S Cass Ave, Argonne, IL 60439 USA
[4] Northwestern Univ, Dept Mat Sci & Engn, Evanston, IL 60208 USA
来源：
2019 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO) | 2019年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The dewetting resistance of Au 50 nm films fabricated atop Ti/Ta/W/Cr/Al adhesion layers (0.5-5 nm) was investigated. Results show sub-nanometer Ta has superior stability under thermal stress, while W & Ti show best plasmonic response. (C) 2019 The Author(s)
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