Introduction to Conductive Adhesive Film Technology

被引：0
|
作者：
Liu, Wei De [1 ]
Li, Ze Ming [1 ]
Ling, Song Wen [1 ]
Zhang, Wen Jie [1 ]
Wu, Chi Kwan [1 ]
机构：
[1] 3M China Ltd, 3M China R&D Ctr, 222 TianLin Rd, Shanghai 200233, Peoples R China
来源：
2010 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & TECHNICAL EXHIBITION ON EMC RF/MICROWAVE MEASUREMENTS & INSTRUMENTATION | 2010年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The paper describes typical structures of conductive adhesives and anisotropic conductive adhesive film. A tailored conductive particle with optimum loading is important to a good-performance adhesive. The paper also discuss typical applications in electronic devices for solving electrical connection issue, ESD grounding issue, EMI shielding issue and particular for anisotropic conductive adhesive's special application for flex bonding, chip bonding to PCB or glass surface. The diversity of conductive adhesives provides many effective solutions to solve design or assembly issues.
引用
收藏
页码：1664 / 1667
页数：4
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