Mechanical and tribological properties of 100-nm thick alumina films prepared by atomic layer deposition on Si(100) substrates
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作者:
Alamgir, Asad
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Tallinn Univ Technol, Dept Mech & Ind Engn, Ehitajate Tee 5, EE-19086 Tallinn, EstoniaTallinn Univ Technol, Dept Mech & Ind Engn, Ehitajate Tee 5, EE-19086 Tallinn, Estonia
Alamgir, Asad
[1
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Bogatov, Andrei
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Yashin, Maxim
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Tallinn Univ Technol, Dept Mech & Ind Engn, Ehitajate Tee 5, EE-19086 Tallinn, EstoniaTallinn Univ Technol, Dept Mech & Ind Engn, Ehitajate Tee 5, EE-19086 Tallinn, Estonia
Yashin, Maxim
[1
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Podgursky, Vitali
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Tallinn Univ Technol, Dept Mech & Ind Engn, Ehitajate Tee 5, EE-19086 Tallinn, EstoniaTallinn Univ Technol, Dept Mech & Ind Engn, Ehitajate Tee 5, EE-19086 Tallinn, Estonia
Podgursky, Vitali
[1
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[1] Tallinn Univ Technol, Dept Mech & Ind Engn, Ehitajate Tee 5, EE-19086 Tallinn, Estonia
The study investigates mechanical and tribological properties of alumina (Al2O3) films prepared on Si(100) substrates. The 100-nm thick films were deposited by atomic layer deposition. Nanoindentation and nano-scratch tests were performed with Berkovich and sphero-conical diamond indenters, respectively. Energy-dispersive X-ray spectroscopy and optical and scanning electron microscopy were used to analyse the surface morphology and chemical composition of the thin films. X-ray diffraction was used to characterize their crystal structure. Crystallization was found to start at 1100 degrees C after 3 hours of annealing. The hardness and tribological properties of the alumina films were influenced by the substrate in nanoindentation and nano-scratch tests. Within the relatively low load range (5-50 mN), the coefficient of friction of Si and alumina against diamond depended on the load, most likely due to a change in the elastic/plastic deformation behaviour within the Si substrate.
机构:
Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China
Li, Ming
Li, Haiou
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Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China
Li, Haiou
Tang, Chak Wah
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Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China
Tang, Chak Wah
Lau, Kei May
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Hong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R ChinaHong Kong Univ Sci & Technol, Dept Elect & Comp Engn, Kowloon, Hong Kong, Peoples R China