A bi-potential contact formulation for recoverable adhesion between soft bodies based on the RCC interface model

被引:5
|
作者
Hu, L. B. [1 ]
Cong, Y. [1 ]
Joli, P. [1 ]
Feng, Z-Q [1 ,2 ]
机构
[1] Univ Evry, LMEE, Univ Paris Saclay, F-91020 Evry, France
[2] Southwest Jiaotong Univ, Sch Mech & Aerosp Engn, Chengdu, Peoples R China
基金
中国国家自然科学基金;
关键词
Dynamic contact; Adhesion; RCC model; Bi-potential method; Time-integration; Hyperelastic materials; COUPLING ADHESION; CELL-ADHESION; FRICTION; DEFORMATION; TRANSITION;
D O I
10.1016/j.cma.2021.114478
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
An extended, ready-to-implement 3D model for quasi-industrial problems of contact with friction and recoverable interface adhesion between soft material is formulated using the Raous-Cangemi-Cocou (RCC) interface model and a bi-potential based resolution method. According to the RCC description, the recoverable adhesive interface behaviour derives from a free surface energy and a surface dissipation pseudo-potential. The obtained interface law describes both the de-bonding process of adhesive links due to tangential and normal interface deformation, and reversely, the bonding process that takes place when two surfaces approach close enough. We then propose an associated formulation coupling 3D extended interface law and Blatz-Ko hyperelastic material, that enables modelling large deformations of foam type soft matters under conditions of contact and friction with recoverable adhesion. In the end, the subsequent local contact nonlinear equations are solved using a Newton-like algorithm within the bi-potential framework. Numerical examples are performed to demonstrate the capacity of the proposed approach. (c) 2021 Elsevier B.V. All rights reserved.
引用
收藏
页数:21
相关论文
共 17 条
  • [1] A bi-potential contact formulation of orthotropic adhesion between soft bodies
    Hu, L. B.
    Cong, Y.
    Renaud, C.
    Feng, Z-Q
    [J]. COMPUTATIONAL MECHANICS, 2022, 69 (04) : 931 - 945
  • [2] A bi-potential contact formulation of orthotropic adhesion between soft bodies
    L. B. Hu
    Y. Cong
    C. Renaud
    Z.-Q. Feng
    [J]. Computational Mechanics, 2022, 69 : 931 - 945
  • [3] Adhesion at the wavy contact interface between two elastic bodies
    Adams, GG
    [J]. JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME, 2004, 71 (06): : 851 - 856
  • [4] A cell-based smoothed finite element method for multi-body contact analysis within the bi-potential formulation
    Li, Yan
    Chen, Qianwei
    Feng, Zhiqiang
    [J]. ENGINEERING ANALYSIS WITH BOUNDARY ELEMENTS, 2023, 148 : 256 - 266
  • [5] Formulation of contact between two continuous bodies with adhesion in finite deformations
    Bretelle, AS
    Cocu, M
    Monerie, Y
    [J]. COMPTES RENDUS DE L ACADEMIE DES SCIENCES SERIE II FASCICULE B-MECANIQUE PHYSIQUE ASTRONOMIE, 2000, 328 (03): : 203 - 208
  • [6] An adhesion and friction model for the contact between two deformable bodies
    Raous, M
    Cangemi, L
    Cocu, M
    [J]. COMPTES RENDUS DE L ACADEMIE DES SCIENCES SERIE II FASCICULE B-MECANIQUE PHYSIQUE CHIMIE ASTRONOMIE, 1997, 325 (09): : 503 - 509
  • [7] Contact Analysis Within the Bi-Potential Framework Using Cell-Based Smoothed Finite Element Method
    Chen, Qianwei
    Li, Yan
    Feng, Zhiqiang
    Chen, Huijian
    [J]. INTERNATIONAL JOURNAL OF COMPUTATIONAL METHODS, 2022, 19 (06)
  • [8] An interface finite element based on a frictional contact formulation with an associative plasticity model for the tangential interaction
    Michaloudis, G.
    Konyukhov, A.
    Gebbeken, N.
    [J]. INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, 2017, 111 (08) : 753 - 775
  • [9] Mechanical analysis of adhesion between wearable electronics and human skin based on crack theory of bi-material interface
    Fu, Yutong
    Yang, Heng
    [J]. International Journal of Solids and Structures, 2022, 254-255
  • [10] Mechanical analysis of adhesion between wearable electronics and human skin based on crack theory of bi-material interface
    Fu, Yutong
    Yang, Heng
    [J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2022, 254