Effect of sintering germanium epilayers on dislocation dynamics: From theory to experimental observation

被引:3
|
作者
Bioud, Youcef A. [1 ,2 ]
Rondeau, Maxime [1 ]
Boucherif, Abderraouf [1 ]
Patriarche, Gilles [3 ]
Drouin, Dominique [1 ,2 ]
Ares, Richard [1 ]
机构
[1] Univ Sherbrooke, Inst Interdisciplinaire Innovat Technol 3IT, CNRS UMI 3463, Lab Nanotechnol Nanosyst LN2, 3000 Blvd Univ, Sherbrooke, PQ J1K 0A5, Canada
[2] Univ Sherbrooke, Inst Quant, Dept Phys, Sherbrooke, PQ J1K 2R1, Canada
[3] Univ Paris Saclay, Ctr Nanosci & Nanotechnol, C2N, Site Marcoussis Route Nozay, F-91460 Marcoussis, France
基金
加拿大自然科学与工程研究理事会;
关键词
Defect-engineering; Heteroepitaxy; Dislocation-void interaction; Sintering of porous materials; Germanium-on-Silicon virtual substrate; HIGH-QUALITY GE; SI; REDUCTION; DENSITIES; LAYERS; GROWTH; SURFACE; GAAS; AREA;
D O I
10.1016/j.actamat.2020.09.047
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
High-quality germanium epilayers on Si with low threading-dislocation density were achieved by sintering of porous Ge/Si films. The process consists in the formation of porous Ge nanostructures by dislocation-selective electrochemical etching of Ge/Si films, followed by high-temperature treatment to generate a monocrystalline, voided Ge layer that intercepts dislocations and prevents them from propagating to the sample surface. In this work, we model the morphological changes that occur during the thermal treatment-induced surface diffusion of an axially symmetric hole. Simulations and experiments show individual large spherical voids, aligned along the dislocation core. The creation of voids could facilitate interactions between dislocations, enabling the dislocation network to change its connectivity in a way that facilitates the subsequent annihilation of dislocation segments. This confirms that thermally activated processes such as state diffusion of porous materials provide mechanisms whereby the defects are removed or arranged in configurations of lower energy. This demonstration paves the way to develop a virtual substrate on many other heterostructures for potential applications in integrated photonic and optoelectronic devices. (C) 2020 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:608 / 618
页数:11
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