Texture evolution and strengthening mechanism of single crystal copper during ECAP

For finding a process for improving the strength of single crystal Cu while still maintaining good plasticity and electrical conductivity, the die with an internal angle (Phi) = 105 degrees and an outer curvature angle (psi) = 37 degrees was used to prepare the equal channel angular pressing (ECAP) deformation by route Bc. The deformation behavior of single crystal copper during ECAP was investigated through electron backscatter diffraction (EBSD), optical microscope (OM) and X-ray diffraction (XRD). The mechanical properties and electronic conductivity after deformation were tested. The results show that the texture evolution is {111} <112> (initial) -> {111} <110> -> {111} <112> -> {112} <110> during 4 passes deformation. The tensile strength and the hardness of single crystal copper increased 123% and 115% respectively after four passes, the electrical conductivity has no obvious decrease. This result indicates that ECAP method can significantly improve the strength of single crystal copper, simultaneously, the plasticity and conductivity of the material remains at an excellent level.