White LEDs and modules in chip-on-board technology for general lighting

被引:0
|
作者
Hartmann, Paul [1 ]
Wenzl, Franz P. [2 ]
Sommer, Christian [2 ]
Pachler, Peter [1 ]
Hoschopf, Flans [1 ]
Schweighart, Marko [1 ]
Hartmann, Martin [1 ]
Kuna, Ladislav [2 ]
Jakopic, Georg [2 ]
Leising, Guenther [2 ]
Tasch, Stefan [1 ]
机构
[1] TridonicAtco Optoelect GmbH, Technol Pk 10, A-8380 Jennersdorf, Austria
[2] Joanneum Res, Inst Nanostruct Mat & Photon, Weiz, Austria
关键词
D O I
10.1117/12.682988
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
At present, light-emitting diode (LED) modules in various shapes are developed and designed for the general lighting, advertisement, emergency lighting, design and architectural markets. To compete with and to surpass the performance of traditional lighting systems, enhancement of Lumen output and the white light quality as well as the thermal management and the luminary integration are key factors for success. Regarding these issues, white LEDs based on the chip-on-board (COB) technology show pronounced advantages. State of-the-art LEDs exploiting this technology are now ready to enter the general lighting segments. We introduce and discuss the specific properties of the Tridonic COB technology dedicated for general lighting. This technology, in combination with a comprehensive set of tools to improve and to enhance the Lumen output and the white light quality, including optical simulation, is the scaffolding for the application of white LEDs in emerging areas, for which an outlook will be given.
引用
收藏
页数:7
相关论文
共 50 条
  • [31] Evaluation of die coating materials for chip-on-board technology insertion in spaceborne applications
    Le, BQ
    Nhan, E
    Maurer, RH
    Lew, AL
    Lander, JR
    Lehtonen, SJ
    Darrin, MAG
    1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, : 142 - 147
  • [32] Research Note: LED chip-on-board packaging technology for strict colour tolerance
    Zhang, J.
    Ge, P.
    Zhou, Z.
    Liu, D.
    Wang, H.
    Su, J.
    LIGHTING RESEARCH & TECHNOLOGY, 2017, 49 (08) : 1052 - 1057
  • [33] CONSIDERATIONS FOR CHOOSING CHIP-ON-BOARD ENCAPSULANTS.
    Burkhart, Art
    Bonneau, Mark
    Electri-onics, 1985, 31 (10): : 67 - 69
  • [34] Degradation of bondcontacts in chip-on-board microelectronic assemblies
    Paul, M
    Berek, H
    Kaden, G
    Schneider, W
    MATERIALS AND CORROSION-WERKSTOFFE UND KORROSION, 1997, 48 (03): : 171 - 175
  • [35] CHIP-ON-BOARD: AN ECONOMICAL PACKAGING SOLUTION.
    Fuchs, Edward
    Electronic Packaging and Production, 1985, 25 (01): : 182 - 185
  • [36] Thermal analysis of a wirebond chip-on-board package
    Pang, JHL
    Tan, CK
    ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 1998, : 481 - 487
  • [37] Layer Encapsulation of Quantum Dots on Chip on Board Type White LEDs
    Kwak, Seong Kwon
    Yoo, Tae Wook
    Kim, Bo-Sung
    Lee, Sang Mun
    Kim, Seok Won
    Lee, Dong Wook
    Hur, Youngjune
    Park, Lee Soon
    MOLECULAR CRYSTALS AND LIQUID CRYSTALS, 2012, 564 : 18 - 25
  • [38] Development of a cleaning process for chip-on-board manufacture
    Gruebel, H.
    Galvanotechnik, 1996, 87 (07):
  • [39] White LEDS for rural lighting
    Sebitosi, AB
    Pillay, P
    2003 IEEE POWER ENGINEERING SOCIETY GENERAL MEETING, VOLS 1-4, CONFERENCE PROCEEDINGS, 2003, : 2619 - 2623
  • [40] Optical Performance Enhancement for Chip-on-Board Packaging LEDs by Adding TiO2/Silicone Encapsulation Layer
    Zheng, Huai
    Li, Lan
    Lei, Xiang
    Yu, Xingjian
    Liu, Sheng
    Luo, Xiaobing
    IEEE ELECTRON DEVICE LETTERS, 2014, 35 (10) : 1046 - 1048