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Solution-printable fullerene/TiS2 organic/inorganic hybrids for high-performance flexible n-type thermoelectrics
被引:191
|作者:
Wang, Liming
[1
]
Zhang, Zimeng
[1
]
Geng, Linxiao
[2
]
Yuan, Tianyu
[3
]
Liu, Yuchen
[1
]
Guo, Juchen
[2
]
Fang, Lei
[3
]
Qiu, Jingjing
[4
]
Wang, Shiren
[1
]
机构:
[1] Texas A&M Univ, Dept Ind & Syst Engn, College Stn, TX 77843 USA
[2] Univ Calif Riverside, Dept Chem & Environm Engn, Riverside, CA 92521 USA
[3] Texas A&M Univ, Dept Chem, College Stn, TX 77843 USA
[4] Texas Tech Univ, Dept Mech Engn, Lubbock, TX 77409 USA
基金:
美国国家科学基金会;
关键词:
BISMUTH-ANTIMONY TELLURIDE;
THIN-FILMS;
FIGURE;
MERIT;
NANOCOMPOSITES;
EFFICIENCY;
POLYMER;
INTERCALATION;
BATTERIES;
MOBILITY;
D O I:
10.1039/c7ee03617e
中图分类号:
O6 [化学];
学科分类号:
0703 ;
摘要:
Solution-printable and flexible thermoelectric materials have attracted great attention because of their scalable processability and great potential for powering flexible electronics, but it is challenging to integrate mechanical flexibility, solution-printability and outstanding thermoelectric properties together. In particular, such an n-type thermoelectric material is highly sought after. In this paper, 2D TiS2 nanosheets were exfoliated from layered polycrystalline powders, and then assembled with C-60 nanoparticles, resulting in a new class of flexible n-type thermoelectric materials via a concurrent enhancement in the power factor and a reduction in thermal conductivity. The resultant C-60/TiS2 hybrid films show a ZT approximate to 0.3 at 400 K, far superior to the state-of-the-art solution-printable and flexible n-type thermoelectric materials. In particular, such a thermoelectric property rivals that of single-crystal TiS2-based thermoelectric materials, which are expensive, difficult to synthesize, and unsuitable for solution printing. A solution of the C-60/TiS2 hybrid was also used as an ink for printing large-area flexible and spatial thermoelectric devices. An outstanding output power of 1.68 W m(-2) was generated at a temperature gradient of 20 K. This work paves the way for flexible, solution-printable, high-performance thermoelectric materials for flexible electronics.
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页码:1307 / 1317
页数:11
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