Solution-printable fullerene/TiS2 organic/inorganic hybrids for high-performance flexible n-type thermoelectrics

被引:191
|
作者
Wang, Liming [1 ]
Zhang, Zimeng [1 ]
Geng, Linxiao [2 ]
Yuan, Tianyu [3 ]
Liu, Yuchen [1 ]
Guo, Juchen [2 ]
Fang, Lei [3 ]
Qiu, Jingjing [4 ]
Wang, Shiren [1 ]
机构
[1] Texas A&M Univ, Dept Ind & Syst Engn, College Stn, TX 77843 USA
[2] Univ Calif Riverside, Dept Chem & Environm Engn, Riverside, CA 92521 USA
[3] Texas A&M Univ, Dept Chem, College Stn, TX 77843 USA
[4] Texas Tech Univ, Dept Mech Engn, Lubbock, TX 77409 USA
基金
美国国家科学基金会;
关键词
BISMUTH-ANTIMONY TELLURIDE; THIN-FILMS; FIGURE; MERIT; NANOCOMPOSITES; EFFICIENCY; POLYMER; INTERCALATION; BATTERIES; MOBILITY;
D O I
10.1039/c7ee03617e
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Solution-printable and flexible thermoelectric materials have attracted great attention because of their scalable processability and great potential for powering flexible electronics, but it is challenging to integrate mechanical flexibility, solution-printability and outstanding thermoelectric properties together. In particular, such an n-type thermoelectric material is highly sought after. In this paper, 2D TiS2 nanosheets were exfoliated from layered polycrystalline powders, and then assembled with C-60 nanoparticles, resulting in a new class of flexible n-type thermoelectric materials via a concurrent enhancement in the power factor and a reduction in thermal conductivity. The resultant C-60/TiS2 hybrid films show a ZT approximate to 0.3 at 400 K, far superior to the state-of-the-art solution-printable and flexible n-type thermoelectric materials. In particular, such a thermoelectric property rivals that of single-crystal TiS2-based thermoelectric materials, which are expensive, difficult to synthesize, and unsuitable for solution printing. A solution of the C-60/TiS2 hybrid was also used as an ink for printing large-area flexible and spatial thermoelectric devices. An outstanding output power of 1.68 W m(-2) was generated at a temperature gradient of 20 K. This work paves the way for flexible, solution-printable, high-performance thermoelectric materials for flexible electronics.
引用
收藏
页码:1307 / 1317
页数:11
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