Parameters influencing the flatness and stability of capacitive pressure sensors fabricated with wafer bonding

被引：8
|
作者：
Goustouridis, D
Tsoukalas, D
Normand, P
Kontos, AG
Raptis, Y
Anastassakis, E
机构：
[1] NCSR Demokritos, Inst Microelect, Aghia Paraskevi 15310, Greece
[2] Natl Tech Univ Athens, Dept Phys, Zografou 15780, Greece
来源：
SENSORS AND ACTUATORS A-PHYSICAL | 1999年 / 76卷 / 1-3期
关键词：
silicon; capacitive; pressure; wafer bonding;
D O I：
10.1016/S0924-4247(99)00040-0
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this work we present detailed optical and electrical characterization results on silicon capacitive pressure sensing elements. The device fabrication technology is based on the wafer bonding technique. Using the micro-Raman technique, we investigate the influence of specific process steps as well as of the wafer bonding conditions-performed either in air or in nitrogen ambient-on the flatness and stress distribution of the pressure sensing diaphragms. Emphasis is also given on drift as well as on fatigue measurements since these effects determine the reliability of the devices. (C) 1999 Elsevier Science S.A. All rights reserved.
引用
收藏
页码：403 / 408
页数：6
相关论文
共 35 条
  • [21] Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor
    Mu, Fengwen
    Xu, Yang
    Shin, Seongbin
    Wang, Yinghui
    Xu, Hengyu
    Shang, Haiping
    Sun, Yechao
    Yue, Lei
    Tsuyuki, Tatsurou
    Suga, Tadatomo
    Wang, Weibing
    Chen, Dapeng
    MICROMACHINES, 2019, 10 (10)
  • [22] Fabrication of capacitive absolute pressure sensor using Si-Au eutectic bonding in SOI wafer
    Lee, Kang Ryeol
    Kim, Kunnyun
    Park, Hyo-Derk
    Kim, Yong Kook
    Choi, Seung-Woo
    Choi, Woo-Beom
    INTERNATIONAL MEMS CONFERENCE 2006, 2006, 34 : 393 - 398
  • [23] Lithography-Based Fabricated Capacitive Pressure Sensitive Touch Sensors for Multimode Intelligent HMIs
    Mehmood, Muhammad Qasim
    Zulfiqar, Muhammad Hamza
    Goyal, Amit Kumar
    Malik, Muhammad Shumail
    Khan, Wasif Tanveer
    Khan, Muhammad Atif
    Zubair, Muhammad
    Massoud, Yehia
    IEEE ACCESS, 2023, 11 : 127411 - 127421
  • [24] An Optically Transparent Capacitive Micromachined Utrasonic Transducer (CMUT) Fabricated Using SU-8 or BCB Adhesive Wafer Bonding
    Zhang, Xiao
    Adelegan, Oluwafemi
    Yamaner, F. Yalcin
    Oralkan, Omer
    2017 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IUS), 2017,
  • [25] Capacitive pressure sensor with wafer-through silicon vias using SOI-Si direct wafer bonding and glass reflow technique
    Kim, Jun-Ku
    Baek, Chang-Wook
    IEICE ELECTRONICS EXPRESS, 2013, 10 (15):
  • [26] Capacitive absolute pressure sensor with vacuum cavity formed by bonding silicon to SOI wafer for upper air observations
    Lee, KR
    Kim, K
    Kim, YK
    Park, HD
    Choi, SW
    Choi, WB
    Ju, BK
    MEMS 2006: 19th IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest, 2006, : 618 - 621
  • [27] A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters
    Abdolreza R. Mohammadi
    Chad P. J. Bennington
    Mu Chiao
    Microsystem Technologies, 2011, 17 : 149 - 160
  • [28] A lateral resonant pressure sensor fabricated via fusion bonding, wafer thinning and reactive-ion-etching
    Welham, CJ
    Greenwood, J
    Bertioli, M
    EUROSENSORS XII, VOLS 1 AND 2, 1998, : 353 - 356
  • [29] A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters
    Mohammadi, Abdolreza R.
    Bennington, Chad P. J.
    Chiao, Mu
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2011, 17 (01): : 149 - 160
  • [30] Highly Sensitive Porous PDMS-Based Capacitive Pressure Sensors Fabricated on Fabric Platform for Wearable Applications
    Masihi, Simin
    Panahi, Masoud
    Maddipatla, Dinesh
    Hanson, Anthony J.
    Bose, Arnesh K.
    Hajian, Sajjad
    Palaniappan, Valliammai
    Narakathu, Binu B.
    Bazuin, Bradley J.
    Atashbar, Massood Z.
    ACS SENSORS, 2021, 6 (03) : 938 - 949
1234