Silicon Probe Measurement and Characterization in Sub-THz Range

被引:6
|
作者
Zhu, Haotian [1 ,2 ]
Gauthier, Jules [1 ]
Wu, Ke [1 ]
机构
[1] Ecole Polytech Montreal, Poly Grames Res Ctr, Montreal, PQ H3T 1J4, Canada
[2] Univ PSL, Sorbonne Univ, CNRS, LERMA,Observ Paris, F-75014 Paris, France
基金
加拿大自然科学与工程研究理事会;
关键词
Dielectric transmission line; laser micromachining; probe technology; silicon assembling; substrate integrated image guide (SIIG); WAVE-GUIDE;
D O I
10.1109/TTHZ.2020.3013802
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We propose, investigate, and demonstrate a pure and simple dielectric probe operating in the sub-terahertz range with an example band of interest 190-220 GHz. High-resistivity silicon technology is deployed for this non-TEM mode probe development as it presents a viable low-loss material. A T-shape alignment dowel was used to integrate the silicon probe with the waveguide block. The probe can be used to measure and characterize the low permittivity-based dielectric waveguide transmission line and its building components free from the use of any transition structures and TEM-mode probes. For demonstration, the silicon probe was used to measure a substrate integrated image guide and its components in the range of 190-220 GHz. A substrate integrated image guide (SIIG)-based thru, reflect, and line (TRL) calibration kit was developed, and a two-tier TRL calibration was used to characterize the SIIG.
引用
收藏
页码:606 / 616
页数:11
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