Abnormal Grain Growth in Cu6Sn5 Grains Formed at Sn-based Solder/Cu Interfaces

被引：0
|
作者：
Yang, Ming [1 ]
Li, Mingyu [1 ]
Wu, Jianxin [2 ]
Xu, Jinhua [2 ]
机构：
[1] Harbin Inst Technol, Shenzhen Grad Sch, Shenzhen 518055, Peoples R China
[2] Yik Shing Tat Ind Co Ltd, Shenzhen 518101, Peoples R China
来源：
2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2014年
关键词：
lead-free solders; abnormal growth; diffusion; IMC; EUTECTIC SOLDERS; CU; LIQUID; CU3SN;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential growth of the Cu6Sn5 at the grain boundary in solder matrix. Additionally, the effects of solder composition on the interfacial IMC growth are evaluated. The results indicate that the Ag addition retards IMC growth upon aging by inhibiting the diffusion of Cu.
引用
收藏
页码：1181 / 1185
页数：5
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