共 50 条
- [41] Reliability and copper interconnections with low dielectric constant materials [J]. LOW-DIELECTRIC CONSTANT MATERIALS IV, 1998, 511 : 305 - 316
- [43] Challenges of plasma damage of low dielectric constant materials [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2007, 234
- [44] Research progress in ceramic dielectric energy storage materials [J]. Cailiao Gongcheng/Journal of Materials Engineering, 2022, 50 (04): : 96 - 103
- [45] Low dielectric constant polymer materials as bottom antireflective coating layers for both KrF and ArF lithography [J]. Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2002, 41 (6 B): : 4046 - 4050
- [46] Low dielectric constant polymer materials as bottom antireflective coating layers for both KrF and ArF lithography [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2002, 41 (6B): : 4046 - 4050
- [48] Advanced Materials with Low Dielectric Constant and Low Coefficient of Thermal Expansion [J]. 2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2015, : 88 - 91
- [50] Research Progress of High-temperature Resistance Polymer-based Energy Storage Dielectric Materials [J]. Gaodianya Jishu/High Voltage Engineering, 2024, 50 (06): : 2309 - 2318