Searching for greater fab productivity with 300mm Prime

被引：0

作者：

Fosnight, William ^{[1
]}

Hofmeister, Christopher ^{[1
]}

机构：

[1] Brooks Automat, Semicond Prod Grp, Chelmsford, MA 01824 USA

来源：

SOLID STATE TECHNOLOGY | 2006年 / 49卷 / 07期

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The ability to improve IC manufacturing costs has been one of the great success stories of the semiconductor industry. The dramatic reduction in cost per transistor has been enabled by vast technology innovation. Recent data indicates that the semiconductor industry is poised to depart from the historic rate of productivity improvement [1]. One potential way to improve productivity is to reduce fab cycle time. With these challenges in mind, International SEMATECH Manufacturing Initiative (ISMI) began its 300mm Prime initiative to address fab productivity challenges going forward and ensure that the industry does not fall behind its historic rate of improvement [2].

引用

页码：89 / +

页数：3

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