Stress and Thermal Modeling of Microbolometer using COMSOL Multiphysics Simulator

被引：0
|
作者：
Deng, Yu-Zhen [1 ]
Tang, Shiang-Feng [2 ]
Tung, Der-Kuo [1 ]
机构：
[1] Natl Def Univ, Chung Cheng Inst Technol, Dept Elect & Elect Engn, Tayuan 33000, Tauyuan County, Taiwan
[2] Natl Chung Shun Inst Sci & Technol, Mat & Electropt Res Div, Tayuan 32599, Tauyuan County, Taiwan
来源：
PROCEEDINGS OF 4TH IEEE INTERNATIONAL CONFERENCE ON APPLIED SYSTEM INNOVATION 2018 ( IEEE ICASI 2018 ) | 2018年
关键词：
Microbolometer; COMSOL Multiphysics; Thermal Conductivity; Heat-transfer Model;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this research, we have proposed the analytical modeling of the stress and surface temperature distribution on the microbolometer pixel is significant for optimizing its performance. Therefore, this study investigates the stress including thermo distributive characteristics of a microbolometer pixel which is considered with the effects of intrinsic stress, joule heating and incoming IR energy on the microbolometer device structure.
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页码：1149 / 1151
页数：3
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