Surface topography and nanomechanical/tribological behaviour of ultrathin nitride films on silicon

被引:0
|
作者
Wyrobek, JT
Malyska, K
Wrzesinska, H
Rymuza, Z
机构
[1] Warsaw Univ Technol, Inst Micromech & Photon, PL-02525 Warsaw, Poland
[2] Hysitron Inc, Minneapolis, MN USA
[3] Inst Electr Mat Technol, Warsaw, Poland
来源
ZEITSCHRIFT FUR METALLKUNDE | 2004年 / 95卷 / 05期
关键词
nanomechanical tests; nanoscratch tests; ultrathin films; nitride films; MEMS materials;
D O I
10.3139/146.017956
中图分类号
TF [冶金工业];
学科分类号
0806 ;
摘要
Surface topography and roughness characteristics were studied based on the analysis of three dimensional atomic force microscopy images of several multilayer ultrathin-film samples. TiN, CrN and NbN (200 nm thick) were deposited on single crystal n-type silicon without or with a 200 nm thick underlayer of silicon dioxide or silicon nitride. The nitride films were deposited by physical vapour deposition technique and the underlayer films by plasma-enhanced chemical vapour deposition. Nanomechanical studies and nanotribological tests were also conducted to investigate the properties of such films as possible candidates for protective layers on rubbing elements of micro-electromechanical systems. The effect of the underlayer on the surface properties and the mechanical/tribological behaviour was evaluated as well.
引用
收藏
页码:320 / 325
页数:6
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