Spacer strategy for exceptionally low thermal conductivity and high zT in antimony-doped bulk silicon

被引:5
|
作者
Gayner, Chhatrasal [1 ]
Kim, Hoon [1 ]
Kim, Jiyong [1 ]
Kim, Woochul [1 ]
机构
[1] Yonsei Univ, Sch Mech Engn, Seoul, South Korea
基金
新加坡国家研究基金会;
关键词
Thermal conductivity; Thermoelectrics; Spacer effect; THERMOELECTRIC PROPERTIES; HIGH-PERFORMANCE; TEMPERATURE; FIGURE; MERIT; MICA;
D O I
10.1016/j.mtener.2019.03.001
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
In this study, the effects of inserting mica into bulk silicon for thermoelectric use on the alloying, nanosize, and spacer effects that are mainly used to suppress thermal conductivity are examined. Results revealed that nanocrystallinity as well as the extremely high doping amount of antimony in the grains drastically enhance the power factor. Dislocations or vacancies can be induced at the nanoscopic level by performing multiple heat treatments and by inserting spacer materials at the bulk level, which in turn can inhibit the heat transport in high thermally conductive materials. Furthermore, a record and reliable figure-of-merit of similar to 0.6 at 1173 K is obtained for mica-inserted SiSb0.02, in addition to reduced thermal conductivity (similar to 6.5 W/m-K). These observations open avenues for silicon and can further lead to the formation of intermetallic, half-Heusler, and other chalcogenide materials. (C) 2019 Elsevier Ltd. All rights reserved.
引用
收藏
页码:327 / 335
页数:9
相关论文
共 50 条
  • [41] Thermal conductivity of high-porosity heavily doped biomorphic silicon carbide prepared from sapele wood biocarbon
    Parfen'eva, L. S.
    Orlova, T. S.
    Smirnov, B. I.
    Smirnov, I. A.
    Misiorek, H.
    Mucha, J.
    Jezowski, A.
    Cabezas-Rodriguez, R.
    Ramirez-Rico, J.
    PHYSICS OF THE SOLID STATE, 2012, 54 (08) : 1732 - 1739
  • [42] High thermoelectric performance and low thermal conductivity in Cu2-xNaxSe bulk materials with micro-pores
    Zheng Zhu
    Yuewen Zhang
    Hongzhang Song
    Xin-Jian Li
    Applied Physics A, 2019, 125
  • [43] High thermoelectric performance and low thermal conductivity in Cu2-xNaxSe bulk materials with micro-pores
    Zhu, Zheng
    Zhang, Yuewen
    Song, Hongzhang
    Li, Xin-Jian
    APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2019, 125 (08):
  • [44] Extremely low thermal conductivity of high density and ordered 10 nm-diameter silicon nanowires array
    Kikuchi, Akiou
    Yao, Akifumi
    Mori, Isamu
    Ono, Takahito
    Samukawa, Seiji
    APPLIED PHYSICS LETTERS, 2017, 110 (09)
  • [45] High-performance electron-doped GeMnTe2: hierarchical structure and low thermal conductivity
    Dong, Jinfeng
    Pei, Jun
    Zhuang, Hua-Lu
    Hu, Haihua
    Cai, Bowen
    Li, Jing-Feng
    JOURNAL OF MATERIALS CHEMISTRY A, 2019, 7 (48) : 27361 - 27366
  • [46] Thermal Interface Materials with High Thermal Conductivity and Low Young's Modulus Using a Solid-Liquid Metal Codoping Strategy
    Zhang, Xu-Dong
    Zhang, Zi-Tong
    Wang, Hong-Zhang
    Cao, Bing-Yang
    ACS APPLIED MATERIALS & INTERFACES, 2023, 15 (02) : 3534 - 3542
  • [47] Tl-based TlAgX (X = S, Se) monolayers with ultra-low lattice thermal conductivity and high ZT: a first- principles study
    Zhang, Qian
    Li, Jia
    Jin, Yuming
    Wang, Guang
    JOURNAL OF MATERIALS SCIENCE, 2022, 57 (47) : 21607 - 21619
  • [48] Tl-based TlAgX (X = S, Se) monolayers with ultra-low lattice thermal conductivity and high ZT: a first-principles study
    Qian Zhang
    Jia Li
    Yuming Jin
    Guang Wang
    Journal of Materials Science, 2022, 57 : 21607 - 21619
  • [49] HIGH THERMAL CONDUCTIVITY AND HIGH STRENGTH SINTERED REACTION - BONDED SILICON NITRIDE CERAMICS FABRICATED BY USING LOW GRADE Si POWDER
    Kusano, Dai
    Adachi, Shigeru
    Tanabe, Gen
    Hyuga, Hideki
    Zhou, You
    Hirao, Kiyoshi
    ADVANCED PROCESSING AND MANUFACTURING TECHNOLOGIES FOR STRUCTURAL AND MULTIFUNCTIONAL MATERIALS V, 2011, 32 (08): : 67 - 76
  • [50] Low-temperature thermal conductivity of high-purity and doped tantalum single crystals after plastic deformation
    Wasserbäch, W
    Abens, S
    Sahling, S
    PHYSICA STATUS SOLIDI B-BASIC RESEARCH, 2000, 222 (02): : 425 - 444