Ultra-precision orthogonal cutting simulation for oxygen-free high-conductivity copper

被引:21
|
作者
Lin, ZC
Lo, SP
机构
[1] Department of Mechanical Engineering, Natl. Taiwan Institute of Technology, Taipei
关键词
cutting simulation; copper;
D O I
10.1016/S0924-0136(96)02416-8
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents an analytical method for predicting the mechanical state of a machined surface with a finite-element model of orthogonal precision cutting. A geometrical separation criterion for the workpiece at the front edge of the tool is also proposed instead of other criteria, and the application of the method is discussed. The flow stress of oxygen-free high-conductivity copper (OFHC copper) was taken as a function of strain, strain rate and temperature in order to reflect realistic behavior in metal cutting. In this paper, a diamond tool was used to conduct the ultra-precision cutting of the OFHC copper. Through the simulation, the residual stress and strain distributions within the machined sub-layer were calculated analytically, the calculated cutting force being found to agree with the experimental results. The simulation results indicate that as far as the impact of temperature, strain and strain rate on OFHC copper is concerned, that of temperature is the most dramatic. The effect of temperature leads to a smaller residual stress in a machined workpiece and limited deformation of the workpiece surface. If the effect of temperature is not considered, the greater is the cutting velocity, the greater is the residual stress of the workpiece and the greater is the deformation of the workpiece surface. (C) 1997 Elsevier Science S.A.
引用
收藏
页码:281 / 291
页数:11
相关论文
共 50 条
  • [41] Investigation of the Ductile Cutting Behavior of Monocrystalline Yttria-Stabilized Zirconia During Ultra-Precision Orthogonal Cutting
    Yoon, Hae-Sung
    Kwon, Suk Bum
    Nagaraj, Aditya
    Min, Sangkee
    INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, 2019, 20 (09) : 1475 - 1484
  • [42] Investigation of the Ductile Cutting Behavior of Monocrystalline Yttria-Stabilized Zirconia During Ultra-Precision Orthogonal Cutting
    Hae-Sung Yoon
    Suk Bum Kwon
    Aditya Nagaraj
    Sangkee Min
    International Journal of Precision Engineering and Manufacturing, 2019, 20 : 1475 - 1484
  • [43] Thermal contact conductance of ceramic AlN and oxygen-free high-conductivity copper interfaces under low temperature and vacuum for high-temperature superconducting cryocooler cooling
    Wang, J
    Wang, HL
    Zhuang, HR
    REVIEW OF SCIENTIFIC INSTRUMENTS, 2006, 77 (02):
  • [44] Joining of oxygen-free high-conductivity Cu to CuCrZr by direct diffusion bonding without using an interlayer at Low temperature
    Zhao, Can
    Li, Fei
    Chen, Yuanyuan
    Huang, Yuan
    Wang, Zumin
    FUSION ENGINEERING AND DESIGN, 2020, 151
  • [45] EFFECT OF ANNEALING TEMPERATURE ON SUBGRAIN GROWTH DURING RECOVERY IN OXYGEN-FREE HIGH CONDUCTIVITY COPPER
    CHANG, CMR
    SERRANO, JR
    VARMA, SK
    MATERIALS SCIENCE AND ENGINEERING, 1988, 100 : L15 - L18
  • [46] Texture development in oxygen-free high conductivity copper deformed by equal channel angular extrusion
    Waryoba, DR
    Kalu, PN
    SCANNING, 2006, 28 (02) : 121 - 123
  • [47] OXIDATION OF OXYGEN-FREE HIGH CONDUCTIVITY COPPER .1. OXIDATION OF COPPER TO CU2O
    BAUR, JP
    BRIDGES, DW
    FASSELL, WM
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1955, 102 (09) : C219 - C219
  • [48] Cutting performance study of synthetic diamonds tools applied in ultra-precision machining of copper
    Chen, Ning
    Zhang, Guoqing
    Zhou, Menghua
    Xu, Gang
    Li, Yong
    Huang, Guofeng
    Ma, Hongan
    Jia, Xiaopeng
    MODERN PHYSICS LETTERS B, 2021, 35 (03):
  • [49] Anisotropy-Related Machining Characteristics in Ultra-Precision Diamond Cutting of Crystalline Copper
    Wang Z.
    Zhang J.
    Li G.
    Xu Z.
    Zhang H.
    Zhang J.
    Hartmaier A.
    Fang F.
    Yan Y.
    Sun T.
    Nanomanufacturing and Metrology, 2020, 3 (02) : 123 - 132
  • [50] Solderability testing of 95.5Sn-3.9Ag-0.6Cu solder on oxygen-free high-conductivity copper and Au-Ni-Plated kovar
    Edwin P. Lopez
    Paul T. Vianco
    Jerome A. Rejent
    Journal of Electronic Materials, 2003, 32 : 254 - 260