The effect of high-current pulsed electron beam modification on the surface wetting property of polyamide 6

被引:6
|
作者
Chen, Yuan Fang [1 ,2 ]
Zhang, Tao [1 ]
Tang, Meng [1 ]
Xie, Ding [1 ]
Long, Qian [1 ]
Li, Cai Yun [1 ]
机构
[1] Chongqing Univ Technol, Coll Mat Sci & Engn, Chongqing 400054, Peoples R China
[2] Chongqing Key Lab Mould Technol, Chongqing 400054, Peoples R China
来源
E-POLYMERS | 2017年 / 17卷 / 01期
关键词
contact angle; HCPEB; PA6; roughness; surface modification;
D O I
10.1515/epoly-2016-0078
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
This study demonstrates that different modification pulse voltages affect the wetting property of the surface of polyamide 6 (PA6) with a certain regularity. Broadly, the hydrophilic property of PA6's surface increases with increasing pulsed voltage. Based on scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS) analysis, this paper discusses the mechanism by which high current pulsed electron beam (HCPEB)-etching modification influences the surface wettability of PA6. Within a certain range below 28 kV, this effect is caused by an increase of in surface roughness due to HCPEB bombardment of the surface. Within a certain range above 28 kV, HCPEB changes the surface morphology, resulting in changes to the wetting property. Furthermore, by using various pulsed voltages to modify the PA6 surface, this study investigated the ability of the Wenzel model to explain changes in the water contact angle and wetting property of PA6's surface.
引用
收藏
页码:23 / 29
页数:7
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