Cu Diffusion Along Al Grain Boundaries

被引：0

作者：

Dolgopolov, N. ^{[1
]}

Rodin, A. ^{[1
]}

Simanov, A. ^{[1
]}

Gontar, I. ^{[1
]}

机构：

[1] Moscow State Inst Steel & Alloys, Moscow 119049, Russia

来源：

POLISH JOURNAL OF CHEMISTRY | 2009年 / 83卷 / 08期

关键词：

grain boundary diffusion; aluminum; copper; GROWTH; FILMS;

D O I：

暂无

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

Grain boundary diffusion of copper (GBD) in aluminum was investigated by EPMA in the temperature range from 300 to 400 degrees C. The triple product s delta D(gb) (s-segregation coefficient, delta - grain boundary width, D(gb) - GBD coefficient) was calculated using Fisher-Gibbs solution methods - by measuring of GB copper concentration as a functional penetration depth and the contour angle (at the top of diffusion wedge). In the first case s delta D(gb) = 5.1.10(-11) m(3)/s.exp(-102 kJ/mol/RT) and in the second case s delta D(gb) = 1.4.10(-11) m(3)/s.exp(-94 kJ/mol/RT)

引用

页码：1507 / 1513

页数：7

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