THE APPEAL OF A VERNACULAR MODERNISM + MODERN HOUSES

被引：0
|
作者：
MATSUKUMA, H
机构：
来源：
JAPAN ARCHITECT | 1996年 / 22期
关键词：
D O I：
暂无
中图分类号：
TU [建筑科学];
学科分类号：
0813 ;
摘要：
引用
收藏
页码：8 / 9
页数：2
相关论文
共 50 条
  • [31] Vernacular modernism: Home country, globalisation and the built environment
    Palfreyman, Rachel
    ZEITSCHRIFT FUR GERMANISTIK, 2006, 16 (03): : 713 - 714
  • [32] The Walter Gropius House Landscape: A collaboration of modernism and the vernacular
    Kramer, EF
    JOURNAL OF ARCHITECTURAL EDUCATION, 2004, 57 (03) : 39 - 47
  • [33] Sustainability assessment of Bhutanese vernacular wattle and daub houses
    Chettri, Nimesh
    Gautam, Dipendra
    Chikermane, Sanjay
    Prakash, Vipul
    Vaghela, Kiran
    INNOVATIVE INFRASTRUCTURE SOLUTIONS, 2021, 6 (04)
  • [34] Indonesian houses: Tradition and transformation in vernacular architecture.
    Waterson, RA
    PACIFIC AFFAIRS, 2004, 77 (04) : 782 - 784
  • [35] Vernacular houses of Lesvos, Greece: Typology and construction technology
    Jerome, P.
    VERNACULAR HERITAGE AND EARTHEN ARCHITECTURE: CONTRIBUTIONS FOR SUSTAINABLE DEVELOPMENT, 2014, : 41 - 46
  • [36] Practices and demands in retrofitting of vernacular rammed earth houses
    Buzo, A.
    Cho, H. J.
    Genis, L.
    Paccoud, G.
    EARTHEN ARCHITECTURE: PAST, PRESENT AND FUTURE, 2015, : 61 - 66
  • [37] Research on the uses of fire in vernacular houses in the Eurasian Continent
    Tsukidate, T.
    VERNACULAR ARCHITECTURE: TOWARDS A SUSTAINABLE FUTURE, 2015, : 719 - 724
  • [38] Sustainability assessment of Bhutanese vernacular wattle and daub houses
    Nimesh Chettri
    Dipendra Gautam
    Sanjay Chikermane
    Vipul Prakash
    Kiran Vaghela
    Innovative Infrastructure Solutions, 2021, 6
  • [39] Genotype Syntactic Study of Vernacular Houses in Biskra City
    Barkat, Rihane
    Bada, Yassine
    Guney, Yasemin Ince
    ICONARP INTERNATIONAL JOURNAL OF ARCHITECTURE AND PLANNING, 2021, 9 (02): : 703 - 719
  • [40] Rapid Modeling of Chinese Huizhou Traditional Vernacular Houses
    Li, Shang-Lin
    Li, Lin
    Cao, Ming-Wei
    Cao, Li
    Jia, Wei
    Liu, Xiao-Ping
    IEEE ACCESS, 2017, 5 : 20668 - 20683
12345