Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys

被引：11
|
作者：
Lee, Y. Y. [1 ]
Tseng, H. W. [2 ]
Hsiao, Y. H. [2 ]
Liu, C. Y. [2 ]
机构：
[1] Natl Cent Univ, Inst Mat Sci & Engn, Chungli, Taiwan
[2] Natl Cent Univ, Dept Chem & Mat Engn, Chungli, Taiwan
来源：
JOM | 2009年 / 61卷 / 06期
关键词：
Surface Oxide; Solder Alloy; PbSn Solder; Surface Oxide Layer; Oxidation Curve;
D O I：
10.1007/s11837-009-0088-5
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The surface oxidations of molten Sn(Ag, Ni, In, Cu) alloys are studied. We conclude that the microstructure (phase and density) of the surface oxide layer is the key factor for the surface oxidation formation. Also, we found that the microstructure (phase and density) of the Sn surface oxide layer is highly influenced by the additives in the solder alloys, which can be roughly anticipated from the additives' electromagnetic field values and Gibbs free energies of oxide formation. The detailed effect (either retarding or enhancing) of the additives on the surface oxidation is discussed in this paper.
引用
收藏
页码：52 / 58
页数：7
相关论文
共 50 条
  • [21] Experimental and Theoretical Study of the Surface Tension in Liquid Ag–Cu–Sn Alloys
    Ivan G. Kaban
    Sascha Gruner
    Walter Hoyer
    Monatshefte für Chemie / Chemical Monthly, 2005, 136 : 1823 - 1828
  • [22] The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys
    C.M. Gourlay
    J. Read
    K. Nogita
    A.K. Dahle
    Journal of Electronic Materials, 2008, 37 : 51 - 60
  • [23] Microalloying of alloys of the Sn – Ag – Cu system
    B. N. Perevezentsev
    M. N. Kurmaev
    Metal Science and Heat Treatment, 2009, 51 : 540 - 543
  • [24] Electrodeposition of Sn-Ag-Cu alloys
    Arai, S
    Kaneko, N
    DENKI KAGAKU, 1997, 65 (12): : 1102 - 1106
  • [25] Oxidation behavior of molten Cu-Be alloys
    Tanahashi, M
    Miura, J
    Iwadachi, T
    Fujisawa, T
    Yamauchi, C
    SECOND INTERNATIONAL CONFERENCE ON PROCESSING MATERIALS FOR PROPERTIES, 2000, : 57 - 62
  • [26] Exudation of Ag and Cu in internally oxidized Ag-Sn-In-(Cu) alloys
    Schimmel, Gunther
    Kempf, Bernd
    Rettenmayr, Markus
    MATERIALS LETTERS, 2009, 63 (17) : 1521 - 1524
  • [27] Splat formation of molten Sn, Cu and Ni droplets
    Amada, S
    Tomoyasu, K
    Haruyama, M
    SURFACE & COATINGS TECHNOLOGY, 1997, 96 (2-3): : 176 - 183
  • [28] Growth of intermetallics between Sn/Ni/Cu, Sn/Ag/Cu and Sn/Cu layered structures
    Horvath, Barbara
    Illes, Balazs
    Shinohara, Tadashi
    THIN SOLID FILMS, 2014, 556 : 345 - 353
  • [29] Wetting kinetics and wettability enhancement of Pd added electrolytic Ni surface with molten Sn-3.0Ag-0.5Cu solder
    Ho, Cheng-Ying
    Duh, Jenq-Gong
    MATERIALS LETTERS, 2013, 92 : 278 - 280
  • [30] Simulation analysis on surface morphology and hysteresis characteristics of molten Sn-3.0Ag-0.5Cu sitting on the inclined Ni substrate
    Xu, Bingsheng
    Yuan, Zhangfu
    Wu, Yan
    COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2014, 441 : 217 - 225
12345