Surface oxidation of molten Sn(Ag, Ni, In, Cu) alloys

被引：11
|
作者：
Lee, Y. Y. [1 ]
Tseng, H. W. [2 ]
Hsiao, Y. H. [2 ]
Liu, C. Y. [2 ]
机构：
[1] Natl Cent Univ, Inst Mat Sci & Engn, Chungli, Taiwan
[2] Natl Cent Univ, Dept Chem & Mat Engn, Chungli, Taiwan
来源：
JOM | 2009年 / 61卷 / 06期
关键词：
Surface Oxide; Solder Alloy; PbSn Solder; Surface Oxide Layer; Oxidation Curve;
D O I：
10.1007/s11837-009-0088-5
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The surface oxidations of molten Sn(Ag, Ni, In, Cu) alloys are studied. We conclude that the microstructure (phase and density) of the surface oxide layer is the key factor for the surface oxidation formation. Also, we found that the microstructure (phase and density) of the Sn surface oxide layer is highly influenced by the additives in the solder alloys, which can be roughly anticipated from the additives' electromagnetic field values and Gibbs free energies of oxide formation. The detailed effect (either retarding or enhancing) of the additives on the surface oxidation is discussed in this paper.
引用
收藏
页码：52 / 58
页数：7
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