3D printed microstructures for flexible electronic devices

被引:28
|
作者
Liu, Yiming [1 ]
Xu, Yeshou [2 ]
Avila, Raudel [3 ]
Liu, Chao [1 ]
Xie, Zhaoqian [1 ,4 ]
Wang, Lidai [1 ,5 ]
Yu, Xinge [1 ]
机构
[1] City Univ Hong Kong, Dept Biomed Engn, Hong Kong 999077, Peoples R China
[2] Southeast Univ, Minist Educ, Key Lab C&PC Struct, Nanjing 210096, Jiangsu, Peoples R China
[3] Northwestern Univ, McCormick Sch Engn, Dept Mech Engn, Evanston, IL 60208 USA
[4] Northwestern Univ, Dept Civil & Environm Engn, Evanston, IL 60208 USA
[5] CityU Shenzhen Res Inst, Shenzhen 518057, Peoples R China
基金
中国国家自然科学基金;
关键词
3D microprinting; 3D microstructure; IPL-780; photoresist; 3D electronics; flexible electronics; FABRICATION; SKIN;
D O I
10.1088/1361-6528/ab2d5d
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Flexible and stretchable electronics have attracted increasing attention and been widely used in wearable devices and electronic skins, where the circuits for flexible and stretchable electronics are typically in-plane-based 2D geometries. Here, we introduce a 3D microprinting technology that can expand one more dimension of the circuit in flexible electronics. We fabricated three-dimensional serpentine microstructures based on direct laser writing. These microstructures with a thin metal coated layer can be used as stretchable conducting meshes. Soft silicone serving as a substrate and encapsulations for these 3D microstructures enables great light transmittance (>90% in visible light range) and flexibility with 114 degrees bending and 24 degrees twisting. Further optimization of the mechanical design of the 3D microstructures can also enhance the stretchability up to 13.8%. These results indicate 3D flexible electronics can be realized by simple microprinting methods. Furthermore, 3D microprinting would also allow for the precise fabrication of other 3D structures, such as mechanically active 3D mesostructures, for the function of mechanical and electrical testing.
引用
收藏
页数:8
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