Design and fabrication of a valveless micropump based on low temperature co-fired ceramic tape technology

被引:3
|
作者
Huang, Chi-Mo [1 ]
Wang, Yi-Chun [1 ]
机构
[1] Natl Cheng Kung Univ, Dept Mech Engn, Tainan 70101, Taiwan
关键词
LTCC; PERFORMANCE;
D O I
10.1007/s00542-013-1909-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Low temperature co-fired ceramic (LTCC) tape technology has been widely studied in microsystems and microfluidic devices. The current study presented the manufacturing process of a simple and inexpensive micropump which is made of LTCC. The components of micropump including fluidic channels, diaphragm, chamber, and planar diffuser valves were integrated in one LTCC module. Geometries of these components were designed based on numerical analysis. The finite element analysis was used to characterize the displacement of a piezoelectric actuator and the computational fluid dynamics was applied to design the diffuser. The performance of the micropump was optimized and performance of the designed micropump was carefully examined in the experiments. The data revealed that the performance of a micropump can be significantly increased by adding a pair of pockets. Overall, the study demonstrated that LTCC tape technology is a simple and reliable method to fabricate a valveless micropump.
引用
收藏
页码:1111 / 1123
页数:13
相关论文
共 50 条
  • [31] Low Temperature Co-fired Ceramic (LTTC) technology for ridge waveguide filters & multiplexers
    Zaki, KA
    [J]. 2003 IEEE TOPICAL CONFERENCE ON WIRELESS COMMUNICATION TECHNOLOGY, 2003, : 177 - 177
  • [32] Characterization and performance prediction for integral resistors in low temperature co-fired ceramic technology
    Delaney, K
    Barrett, J
    Barton, J
    Doyle, R
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (01): : 78 - 85
  • [33] Characterization and performance prediction for integral capacitors in low temperature co-fired ceramic technology
    Delaney, K
    Barrett, J
    Barton, J
    Doyle, R
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 1999, 22 (01): : 68 - 77
  • [34] Fabrication of embedded microfluidic channels in low temperature co-fired ceramic technology using laser machining and progressive lamination
    Shafique, M. Farhan
    Laister, Andrew
    Clark, Michael
    Miles, Robert E.
    Robertson, Ian D.
    [J]. JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2011, 31 (13) : 2199 - 2204
  • [35] Sintering and thermomechanical behavior of a Low Temperature Co-fired Ceramic
    Heux, A.
    Antou, G.
    Pradeilles, N.
    Delhote, N.
    Karnfelt, C.
    Gallee, F.
    Maitre, A.
    [J]. CERAMICS INTERNATIONAL, 2018, 44 (18) : 22609 - 22615
  • [36] The tape casting process for manufacturing low-temperature co-fired ceramic green sheets: A review
    [J]. Zhou, Hongqing (hqzhou@njtech.edu.cn), 1600, Blackwell Publishing Inc. (101):
  • [37] The tape casting process for manufacturing low-temperature co-fired ceramic green sheets: A review
    Ren, Luchao
    Luo, Xianfu
    Zhou, Hongqing
    [J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2018, 101 (09) : 3874 - 3889
  • [38] Low temperature co-fired ceramic on metal (LTCC-M) packaging technology - Technology, modeling, design issues, and design kit
    Fathy, A
    McGinty, F
    Pendrick, V
    Ayers, G
    Geller, B
    Narayan, Y
    Thaler, B
    Chen, HD
    Liberatore, MJ
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2000, : 261 - 264
  • [39] A Biocompatible Low Temperature Co-fired Ceramic Substrate for Biosensors
    Luo, Jin
    Eitel, Richard E.
    [J]. INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY, 2014, 11 (03) : 436 - 442
  • [40] A Low Temperature Co-fired Ceramic Microfluidic Cell Counter
    Priya, Rathi A.
    Vimala, Juliet A.
    [J]. DYNAMICS OF MACHINES AND MECHANISMS, INDUSTRIAL RESEARCH, 2014, 592-594 : 2261 - 2266