New insights in polarity-dependent oxide breakdown for ultrathin gate oxide

被引:20
|
作者
Wu, E [1 ]
Suñé, J
机构
[1] IBM Corp, Microelect Div, Essex Jct, VT 05452 USA
[2] Univ Autonoma Barcelona, Dept Elect Engn, Bellaterra 08193, Spain
关键词
gate dielectric; MOS devices; oxide; reliability; semiconductor device reliability; TDDB measurements;
D O I
10.1109/LED.2002.801293
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, a quantitative analysis is applied to resolve the newly reported polarity-dependent charge-to-break-down (Q(BD)) data from thick oxides of 6.8 nm down to ultrathin oxides of 1.9 nm. Three independent sets Of Q(BD) data, i.e. n(+)poly/NFET stressed under inversion and accumulation, and p(+) poly/PFET under accumulation are carefully investigated. The QBD degradation observed for p-type anodes, either poly-Si or Si-substrate, can be nicely understood with the framework of maximum energy released by injected electrons. Thus, this work provides a universal and quantitative account for a variety of experimental observations in the time-to-breakdown (T-BD) and Q(BD) polarity-dependence of oxide breakdown.
引用
收藏
页码:494 / 496
页数:3
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