Preparation, thermal properties and thermal reliability of palmitic acid/expanded graphite composite as form-stable PCM for thermal energy storage

被引:381
|
作者
Sari, Ahmet [1 ]
Karaipekli, Ali [1 ]
机构
[1] Gaziosmanpasa Univ, Dept Chem, TR-60240 Tokat, Turkey
关键词
Palmitic acid; Expanded graphite; Form-stable PCM; Thermal energy storage; PHASE-CHANGE MATERIAL; HEAT-TRANSFER; FATTY-ACIDS; BLENDS; CONDUCTIVITY; ENHANCEMENT; PERFORMANCE; MATRIX;
D O I
10.1016/j.solmat.2008.11.057
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
This study is focused on the preparation and characterization of thermal properties and thermal reliability of palmitic acid (PA)/expanded graphite (EG) composite as form-stable phase change material (PCM). The maximum mass fraction of PA retained in EG was found as 80 wt% without the leakage of PA in melted state even when it is heated over the melting point of PA. Therefore, the PA/EG (80/20w/w%) composite was characterized as form-stable PCM. From differential scanning calorimetry (DSC) analysis, the melting and freezing temperatures and latent heats of the form-stable PCM were measured as 60.88 and 60.81 degrees C and 148.36 and 149.66 J/g, respectively. Thermal cycling test showed that the composite PCM has good thermal reliability although it was subjected to 3000 melting/freezing cycles. Fourier transformation infrared (FT-IR) spectroscopic investigation indicated that it has good chemical stability after thermal cycling. Thermal conductivities of PA/EG composites including different mass fractions of EG (5%, 10%, 15% and 20%) were also measured. Thermal conductivity of form-stable PA/EG (80/20w/w%) composite (0.60 W/mK) was found to be 2.5 times higher than that of pure PA (0.17 W/mK). Moreover, the increase in thermal conductivity of PA was confirmed by comparison of the melting and freezing times of pure PA with that of form-stable composite. Based oil all results, it was concluded that the form-stable PA/EG (80/20w/w%) has considerable latent heat energy storage potential because of its good thermal properties, thermal and chemical reliability and thermal conductivity. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码:571 / 576
页数:6
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