High Performance Electronics for High-speed Optical Transceivers in Datacom and Telecom Applications

被引:0
|
作者
Dupuy, Jean-Yves [1 ]
Konczykowska, Agnieszka
Jorge, Filipe
Riet, Muriel
Nodjiadjim, Virginie
机构
[1] Joint Lab Nokia Bell Labs Thales Res & Technol, Lab 3 5, 1 Ave A Fresnel, F-91767 Palaiseau, France
关键词
D O I
暂无
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
We review latest performances, barriers and trends ahead in high performance electronics for terabit optical transceivers in datacorn and telecom applications. Relevant semiconductor technologies are benchmarked and the advantages of InP DHBT for performance-critical applications are highlighted through selected circuits.
引用
收藏
页数:3
相关论文
共 50 条
  • [31] High-speed optical sensor for security applications
    Grevel, TD
    PHOTONICS SPECTRA, 2004, 38 (04) : 90 - +
  • [32] Silicon optical modulator for high-speed applications
    Liu, Ansheng
    Liao, Ling
    Rubin, Doron
    Basak, Juthika
    Nguyen, Hat
    Chetrit, Yoel
    Cohen, Rami
    Izhaky, Nahum
    Paniccia, Mario
    2007 4TH IEEE INTERNATIONAL CONFERENCE ON GROUP IV PHOTONICS, 2007, : 193 - +
  • [33] High-Speed Optical Links for UAV Applications
    Chen, C.
    Grier, A.
    Malfa, M.
    Booen, E.
    Harding, H.
    Xia, C.
    Hunwardsen, M.
    Demers, J.
    Kudinov, K.
    Mak, G.
    Smith, B.
    Sahasrabudhe, A.
    Patawaran, F.
    Wang, T.
    Wang, A.
    Zhao, C.
    Leang, D.
    Gin, J.
    Lewis, M.
    Nguyen, D.
    Quirk, K.
    FREE-SPACE LASER COMMUNICATION AND ATMOSPHERIC PROPAGATION XXIX, 2017, 10096
  • [34] High-speed Optical Correlator with Custom Electronics Interface Design
    Chao, Tien-Hsin
    Lu, Thomas T.
    OPTICAL PATTERN RECOGNITION XXIV, 2013, 8748
  • [35] Coldplate Design for Optimal Thermal Performance of High-Speed Electronics
    Yuksel, Anil
    Mahaney, Vic
    Marroquin, Chris
    PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020), 2020, : 60 - 68
  • [36] Polymer based optical interconnect components for high-speed Datacom approaches - Micromachining supported manufacturing
    Frese, I.
    Schwab, U.
    Nahrstedt, E.
    Klotzbuccher, Th.
    Kunz, St.
    Teubner, U.
    Doll, Th.
    OPTICS COMMUNICATIONS, 2006, 265 (02) : 434 - 440
  • [37] Polymer optical interconnects: Meeting the requirements for datacom and telecom applications
    Shacklette, LW
    Norwood, RA
    Eldada, L
    Glass, C
    Nguyen, D
    Poga, C
    Xu, BP
    Yin, S
    Yardley, JT
    NONLINEAR OPTICAL PROPERTIES OF ORGANIC MATERIALS X, 1997, 3147 : 222 - 232
  • [38] High-speed transparent flexible electronics
    Vaillancourt, Jarrod
    Lu, Xuejun
    han, Xuliang
    Janzen, Daniel C.
    Shih, Wu-Sheng
    INFRARED TECHNOLOGY AND APPLICATIONS XXXIV, PTS 1 AND 2, 2008, 6940
  • [39] NEW MATERIALS FOR HIGH-SPEED ELECTRONICS
    LESTER, F
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1988, 135 (04) : C194 - C194
  • [40] NEW COMPONENTS FOR HIGH-SPEED ELECTRONICS
    CASTAGNE, R
    RECHERCHE, 1985, 16 (165): : 474 - 482